SUSS (1063342), страница 5
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Asdescribed above, bowl 202 having cavity 250 advantageously reduces the amount of produced particulatesduring a spin coating operation. Further, the closed bowlconfiguration assists in maintaining coating uniformitiesby preventing the premature drying of the applied solvents. As a result, chemical coating 240 may be appliedmore evenly, while substantially preventing the yield reducing defects associated with beading and prematuresolvent drying.[0048] Figure 6A illustrates an exemplary spin coatingsystem 300 that may be used to reduce particulate generation in accordance with one embodiment of thepresent invention.
As shown, bowl 202 and lid 201 arepartially contained within a catch cup 302 that includesa first splash ring 303 and a second splash ring 304.Catch cup 302 also includes exemplary floor drain holes310 that drain chemicals that flow out of drain holes 225,and then removed to a drain manifold. An exhaust manifold 308 may also be used to assist in the removal ofair borne particulates. Of course, any number of wellknown exhaust manifolds 308 may be implemented aswell. In this embodiment, the second splash ring 304 ispreferably well suited to meet circular extension 260 andform a labyrinth to substantially prevent the escape ofair borne particulates into the environment surroundingthe spin coating system 300.[0049] Figure 6B is an exploded view of the exemplaryspin coating system 300 illustrating the labyrinth in accordance with one embodiment of the present invention.As shown, when chemicals are being spin coated over5101514the wafer, some chemicals may fly out of cavity 250through the drain holes 225, causing particulates 320 tospread into catch cup 302.
However, the particulates320 that are contained within catch cup 302 are typicallynot a problem because they are removed by exhaustmanifold 308. Because the second splash ring 304 isdesigned to almost contact the circular extension 260 ofbowl 202, for particulates to escape, the particulateswould have to traverse an unlikely path 350 before exiting the spin coating system 300.[0050] As a result of the labyrinth created betweenbowl 202 and second splash ring 304, as well as thefluid capturing cavity 250, the amount of yield reducingparticulates are substantially eliminated. Therefore, theclosed bowl spin coating system 300 provides semiconductor manufacturers with a powerful tool for increasingyields and maintaining substantially particulate free uniform chemical coatings.20Claims1.A spin coating device, comprising:means for applying a chemical fluid to be spincoated over a substrate (230) that is supportedwithin a bowl (202) the bowl having a fluid retaining cavity (250) at an outer edge of the bowl;encapsulating means to contain the substrate(230) in the bowl (202);means for spinning the encapsulated bowl(202) to cause the applied chemical to be spincoated over the surface of the substrate (230);injector means to apply a solvent to an underside edge of the substrate (230), the solvent application being configured to remove an excesschemical beading from the edge of the substrate (230); andmeans for collecting the solvent and the excesschemical beading that flows off of the substratein the fluid retaining cavity (250) while the encapsulated bowl (202) is spinning.253035402.Device according to claim 1, further comprising:45drain means for removing the excess chemicalbeading and the solvent that is collected in thefluid retaining cavity (250) from the bowl (202)when the bowl comes to a substantial stop.503.Device according to claim 1 or 2, further comprising:means for cleaning an interior of the bowl (202)after each substrate (230) is spin coated.554.8Device according to claim 1, 2 or 3, further includinga labyrinth defined between the bowl (202) and acatch cup splash ring (304) the labyrinth being con-15EP 1 015 136 B1the substantially flat underside (214) of the lid (201)is between about 2 mm and about 3 mm separatedfrom a top surface of the substrate (230).figured to substantially prevent particulates from exiting the catch cup (302) during a spin coating operation.5.Device according to any of claims 1 to 4, whereinthe chemical is selected from the group consistingof a photoresist chemical and a spin-on-glasschemical.56.Device according to any of claims 2 to 5, whereinthe bowl (202) has a raised support (204) forholding th substrate (230), and curved walls that define the cavity (250);the encapsulating means comprises a lid(201) configured to mate with the curved walls, thelid having a substantially flat underside (214) that ispositioned in close proximity to a top surface of thesubstrate (230);the injector means comprises fluid injectorholes (221) defined along an injector ring (223) thatis under the substrate (230) the fluid injector holesbeing directed at an underside of the substrate(230) that is near the outer diameter of the substrate; andthe drain means comprises a plurality of drainholes (225) defined on a floor region of the bowl(202), the plurality of drain holes being spaced apartfrom the outer region of the bowl to enable the cavity(250) to hold a fluid while the bowl (202) is spinningat a high rate, and drain the fluid when the bowlslows down.107.Device according to any of claims 1 to 6, whereinthe fluid that is applied to the substrate (230) iscaused to spread over the substrate by a centrifugalforce when the bowl (202) is spinning, the centrifugal force further acting to hold the fluid that spreadsoff of the substrate in the cavity (250) while the bowlis spinning.9.12.
Device according to any of claims 6 to 11, furthercomprising a locking shaft (261) for mechanicallyapplying the lid (201) over the bowl (202), and thelocking shaft being configured to secure the lidwhen the bowl is spinning.13. Device according to any of claims 1 to 12, whereinthe bowl (202) includes a plurality of magnetic padsfor securing the lid (201) to the bowl (202).1514. Device according to any of claims 1 to 13, whereinthe cavity (250) is configured to hold a volume ofbetween about 10 cubic centimeters and about 20cubic centimeters.2015. Device according to any of claims 6 to 14, whereinthe injector ring (223) has an internal surface thatis spaced apart from the underside of the substrate(230).2516.
Device according to any of claims 1 to 15, whereinthe bowl (202) includes a plurality of pins (222) thatare configured to mate and secure the lid (201) tothe bowl (202).3017. Device according to any of claims 12 to 16, whereinthe lid (201) has a hollow internal region (211) thatis configured to receive the locking shaft (261).35408.16Device according to claim 6 or 7, wherein the bowl(202) includes an extension (260) defined outwardly from an outer edge of the curved walls.Device according to claims 6, 7 or 8, wherein thefluid injector holes (221) are defined at an angleranging between about 30 degrees and about 50degrees.4510.
Device according to claim 8 or 9, wherein the catchcup (302) is configured to receive the bowl (202)having the extension (260) defined outwardly froman outer edge of the curved walls, the catch cup further including at least one splash ring (304) that thatdefines a particulate reducing labyrinth with the extension (260).505518. Device according to any of claims 4 to 17, whereinthe catch cup (302) has a draining system and anexhaust system.19. Device according to any of claims 4 to 18, whereinthe catch cup (302) includes a first splash ring (303)configured to sit over a top portion of the catch cup.20.
Device according to claim 19, wherein the catch cup(302) includes a second splash ring (304) that isconfigured to mate with the first splash ring (303),the second splash ring further being configured tosubstantially retain particulates exiting the pluralityof drain holes (225) within the catch cup.21. Device according to any of claims 1 to 20, whereinthe substrate (230) is a semiconductor wafer.22. Device according to any of claims 6 to 21, whereinthe first end of the plurality of injector holes (221) islocated at a first radial distance that is less than asecond radial distance of the second end of the plurality of injector holes.23. Device according to any of claims 6 to 22, wherein11.
Device according to any of claims 6 to 10, wherein917EP 1 015 136 B1a volume of between about 10 cubic centimetersand about 20 cubic centimeters.the plurality of drain holes (225) are defined substantially near a lower portion of the bowl (202).24. Device according to any of claims 6 to 23, whereinthe plurality of injector holes (221) are vertically lower and spaced apart from the substrate (230).25. Device according to any of claims 1 to 24, whereinthe bowl (202) contains a vacuum channel (219) forsecuring the substrate (230) to the bowl (202).51026. Device according to claim 25, wherein vacuumchannel (219) is connected to a vacuum pump.27. Device according to any of claims 16 to 26, whereinthe lid (201) contains a plurality of pin holes configured to mate with a plurality of pins (222) definedon a top lip of the bowl (202).1528. A method for spin coating a substrate, comprising:20applying a chemical fluid to be spin coated overa substrate (230) that is supported within a bowl(202), the bowl having a fluid retaining cavity(250) at an outer edge of the bowl;encapsulating the substrate (230) in the bowl(202);spinning the encapsulated bowl (202) to causethe applied chemical to be spin coated over thesurface of the substrate 230;injecting a solvent in a vicinity of an undersideedge of the substrate (230) to remove an excess chemical beading from the edge of thesubstrate; andcollecting the solvent and the excess chemicalbeading that flows off of the substrate (230) inthe fluid retaining cavity (250) while the encapsulated bowl (202) is spinning.29.
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