thick_resist_processing (1063676), страница 2
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In some cases even a milky, styrofoam-like appearance becomes visible (pictures seeoverleaf). Possible reasons are: A softbake too cool/too short (details see Softbake of Photoresists) Inferior resist adhesion by insufficient substrate pretreatment (see document SubstrateCleaning and Adhesion Promotion), or a substrate surface modified by previous processsteps An exposure intensity too high, with a N2 generation rate too high as a consequence.
Inthis case, try multiple exposure with delays in between. An exposure dose too high. It is generally recommended to evaluate the optimum exposure dose for each process. A photoresist not suitable (photo active compound concentrationtoo high, N2 permeability too low) for the required resist filmthickness. For recommended thick resists, please consult thefirst section of this document.SubstrateAZ and the AZ logo are registered trademarks of AZ Electronic Materials (Germany) GmbH.Photoresists, wafers, plating solutions, etchants and solvents ...Phone: +49 731 977343 0www.microchemicals.eusales@microchemicals.eu-4-.
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