USP_6576055 (1063346), страница 3
Текст из файла (страница 3)
Accordingly,barrier 140.In still another method, gas can be selectively removedfrom the internal air volume 160 as the substrate 112 and thebarrier 140 rotate. For example, the exhaust port 122 can beopen continuously or periodically to WithdraW gaseous orgas-borne constituents from Within the barrier 140.Accordingly, the barrier 140 and/or the barrier support 13420volume 150 from the internal air volume 160 and alloWexcess liquid to drain aWay from the substrate 112.In one embodiment, the noZZle aperture 124, the substrate112, and the drive shaft 132 are each aligned With the axis136 so that the substrate 112 spins about its center and thenoZZle aperture 124 dispenses the liquid to the center of thesubstrate upper surface 113.
In one embodiment, the liquidsupply conduit 123 can be coupled to a source of liquid (not120 ?xed relative to the motor 130 and disposed coaxiallyaround the drive shaft 132 and the substrate 112 to collectexcess liquid ?oWing from the substrate 112. The collectionvessel 120 can include a base 126 extending outWardly fromthe driveshaft 132 beneath the substrate 112, and Walls 125causing the liquid to spread out over the upper surface 113While at the same time spinning the internal air volume 160Rotating the internal air volume 160 can also reduce the rateof convective heat transfer from the substrate 112.Accordingly, the liquid can be deposited to a more uniformthickness over the entire upper surface 113. For example, inone embodiment, the liquid can be deposited to a thicknessthat varies from about ten Angstroms to about thirty Angstroms across the surface of a substrate 112 having a4045diameter of greater than eight inches (up to and exceedingtWelve inches).
In another embodiment, the liquid can bedeposited to a thickness that varies by no greater than aboutten Angstroms across the surface of the substrate 112, or theliquid can be deposited to thicknesses With other thicknessvariations on substrates 112 having other diameters.The liquid supply conduit 123 then disposes the liquid ontoFurthermore, a liquid having a single viscosity can beused to produce layers on the substrate 112 having a greaterrange of thicknesses than is possible Without the barrier 140.For example, in one embodiment, a ?uid having a singleviscosity value of betWeen about ?ve centipoise and abouttWenty centipoise can be deposited on a substrate 112(having a diameter of greater than eight inches, up to andexceeding tWelve inches) to a selected uniform thicknessWithin a range of approximately 3,000 Angstroms.
In oneembodiment, a liquid having a viscosity of from about ?vecentipoise to about ten centipoise can be deposited on thesubstrate 112 to a thickness of from approximately 5,000the upper surface 113 of the substrate 112, Where it ?oWsAngstroms to approximately 8,000 Angstroms by rotatingcollection vessel 120 via a drain tube 127.
The collectionvessel 120 can also include an exhaust port 122 having anadjustable ?oW area to control a How of air past the substrate112 and out of the collection vessel 125.In a method in accordance With one embodiment of theinvention, the control arm 142 positions the barrier 140 onthe barrier support 134 and the substrate 112 and the barrier140 rotate together until the internal air volume 160 is55spinning at approximately the same rate as the substrate 112.outWardly under centrifugal force toWard the edges of thesubstrate 112.
In one aspect of this embodiment, the rotationspeed of both the substrate 112 and the barrier 140 can be upto 4,000 rpm, and in a further aspect of this embodiment, therotation speed can be in the range of from approximately2,000 rpm to approximately 4,000 rpm or some otherrotational velocity.In an alternate method, the liquid supply conduit 123 candispose the liquid on the substrate 112 before the substratethe substrate 112 at a speed of from about 2,000 rpm to about604,000 rpm. The particular viscosity value and rotation rateselected to produce the desired thickness can be selectedbased on such factors as evaporation rate of the liquid.
Inanother embodiment, the thickness can range from approximately 7,000 Angstroms to approximately 10,000 Ang65stroms by depositing on the substrate 112 a liquid having aviscosity of from about ten centipoise to about tWentycentipoise and spinning the substrate at from about 2,000US 6,576,055 B278rpm to about 4,000 rpm. This is unlike some conventionaldifferent viscosity) to deposit liquid layers of differenta control arm 242 having a positioning head 243, in amanner generally similar to that discussed above With reference to FIG.
3. Alternatively, the barrier shaft 247 can bedirectly coupled to an axial actuator 225 to move the barrierthicknesses on different substrates 112.240 upWardly and doWnWardly.devices, Which may require coupling the liquid supplyconduit 123 to a plurality of liquid sources (each having aAnother feature of the apparatus and methods discussedabove With reference to FIG. 3 is that the substrate 112 canbe supported in a manner that does not trap the ?uid againstthe loWer surface 114 of the substrate 112, While at the sametime eliminating the need for rotating the collection vessel120, unlike some conventional apparatuses. Accordingly, theloWer surface 114 of the substrate 112 can remain relativelyfree of contaminants While the liquid is disposed on theupper surface 113.
Furthermore, the apparatus 110 can besimpler to manufacture and operate because the collectionvessel 120 is ?xed relative to the motor 130, eliminating theneed for rotating seals betWeen the drain 121 and the drainline 127.FIG. 4 is a partially schematic, partially cutaWay sideelevation vieW of an apparatus 210 having a barrier 240 thatrotates independently of the substrate 112 in accordanceWith another embodiment of the invention. The apparatus10A feature of the apparatus shoWn in FIG. 4 is that thebarrier 240 can be rotated independently of the substrate112, While still alloWing the barrier 240 to rotate at the samerate as the substrate 112. Conversely, a feature of theapparatus 110 discussed above With reference to FIG.
3 isthat the barrier 140 Will alWays rotate at the same rate as thesubstrate 112 When the barrier 140 is supported by thebarrier support 134, ensuring that the internal air volume 160Will spin at the same rate as the substrate 112.1520From the foregoing, it Will be appreciated that, althoughspeci?c embodiments of the invention have been describedherein for purposes of illustration, various modi?cationsmay be made Without deviating from the spirit and scope ofthe invention. For example, Where the environment adjacentthe substrate includes gases other than air, the barriersdiscussed above With reference to FIGS. 3 and 4 canseparate the other gases into an internal volume and an210 can include a motor 230 having a drive shaft 232external volume.
Accordingly, the invention is not limitedcoupled to a substrate support 233 that supports the substrateexcept as by the appended claims.What is claimed is:112. The drive shaft is rotatable about an axis 236, as 25indicated by arroW A in a manner generally similar to that1.
An apparatus for disposing a ?uid on a ?rst surface ofdiscussed above With reference to FIG. 3. The apparatus 210a microelectronic substrate, the microelectronic substratecan further include a collection vessel 220 disposed annuhaving a second surface facing opposite the ?rst surface, thelarly around the drive shaft 232 and the substrate 112 tocollect ?uid and to exhaust air, also in a manner generallysimilar to that discussed above With reference to FIG. 3.The barrier 240 can include a barrier shaft 247 that30being con?gured such that the microelectronic subconduit 223.
The barrier shaft 247 can be coupled to a motor 35249 (for example, via gears 248a and 248b) to rotate thebarrier 240. Accordingly, the barrier 240 can rotate at a rateindependent of the rate at Which the substrate 112 and thesubstrate support 233 rotate. In one aspect of thisthe barrier 240 and the substrate 112, While an external airvolume 250 remains approximately stationary, in a mannergenerally similar to that discussed above With reference toFIG. 3.4045microelectronic substrate and generally stationary rela50?gured to rotate independently of the ?rst rate ofrotation of the support so that the second rate of rotationof the barrier is adjustable independently of the ?rst55rate of rotation of the support, Wherein the ?rst drivesource includes a ?rst motor coupled to the barrier bya barrier drive shaft and located above the barrier andthe second drive source, the barrier drive shaft extend60second drive source includes a second motor coupled tothe substrate 112 and the evaporation rate of the liquiding upWardly and annularly around the conduit, and thethe support and located beloW the support.2.
The apparatus of claim 1 Wherein the support includesa ?ange facing toWard the second surface of the microelecextend outWardly beyond an outer edge 115 of the substrate112 so that the barrier 240 can be lifted upWardly to accessthe substrate 112, for example to remove the substrate 112after the liquid is disposed on the substrate 112. In a furtheraspect of this embodiment, the barrier 240 can be lifted Withbeing driven by a ?rst drive source separate from asecond drive source that rotates the support and conthe substrate 112 to remove contaminants from the loWersurface.
In one embodiment, the source 271 can be coupledto a temperature controller 272 to control the temperature ofdisposed on the upper surface 113 of the substrate 112.In a further aspect of the embodiment shoWn in FIG. 4, thegap 238 betWeen the barrier 240 and the ?ange 237 canleast partially face toWard the ?rst surface of themicroelectronic substrate and separate a ?rst portion ofgas adjacent the surfaces of the microelectronic substrate and rotating With the microelectronic substratefrom a second portion of gas spaced apart from thetive to the microelectronic substrate, the rotating barriercan be positioned in the gap 238 and can be coupled to asource of cleaning ?uid 271.
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