Электрохимическое модифицирование поверхности металлов с использованием фторсодержащих ионных жидкостей (1105545), страница 21
Текст из файла (страница 21)
– 2010. – V. 12. – P. 1709-1723.50.Kornyshev A.A. Double-Layer in Ionic Liquids: Paradigm Change? // J. Phys. Chem. B. – 2007.– V. 111. – P. 5545-5557.51.Feng G., Zhang J.S., Qiao R. Microstructure and Capacitance of the Electrical Double Layers atthe Interface of Ionic Liquids and Planar Electrodes // J. Phys. Chem. C. – 2009. – V. 113. –P.
4549-4559.52.Oldham K.B. A Gouy–Chapman–Stern model of the double layer at a (metal)/(ionic liquid)interface // J. Electroanal. Chem. – 2008. – V. 613. – P. 131-138.53.Fedorov M.V., Kornyshev A.A. Ionic Liquid Near a Charged Wall: Structure and Capacitance ofElectrical Double Layer // J. Phys. Chem. B. – 2008. – V. 112. – P. 11868-11872.54.Bazant M.Z., Storey B.D., Kornyshev A.A. Double layer in ionic liquids: Overscreening versuscrowding // Phys.
Rev. Lett. – 2011. – V. 106. – P. 046102-(1-4).55.Georgi N., Kornyshev A.A., Fedorov M.V. The anatomy of the double layer and capacitance inionic liquids with anisotropic ions: Electrostriction vs. lattice saturation // J. Electroanal. Chem. –2010. – V. 649. – P. 261-267.56.Su Y.Z., Fu Y.C., Yan J.W., Chen Z.B., Mao B.W. Double Layer of Au(100)/Ionic LiquidInterface And Its Stability in Imidazolium-Based Ionic Liquids // Angew. Chem. Int. Ed. – 2009.– V. 48. – P. 5148-5151.11557.Lockett V., Sedev R., Ralston J., Horne M., Rodopoulos T. Differential capacitance of theelectrical double layer in imidazolium-based ionic liquids: influence of potential, cation size, andtemperature // J.
Phys. Chem. C. – 2008. – V. 112. – P. 7486-7495.58.Islam M.M., Alam M.T., Ohsaka T. Electrical Double-Layer Structure in Ionic Liquids: ACorroboration of the Theoretical Model by Experimental Results // J. Phys. Chem. C. – 2008. –V. 112. – P. 16568-16574.59.Alam M.T., Islam M.M., Okajima T., Ohsaka T. Capacitance Measurements in a Series ofRoom-Temperature Ionic Liquids at Glassy Carbon and Gold Electrode Interfaces // J. Phys.Chem. C. – 2008.
– V. 112. – P. 16600-16608.60.Valleau J.P., Torrie G.M. The electrical double layer. III. Modified Gouy-Chapman theory withunequal ion sizes // J. Chem. Phys. – 1982. – V. 76. – P. 4623-4630.61.Fedorov M.V., Georgi N., Kornyshev A.A. Double layer in ionic liquids: The nature of thecamel shape of capacitance // Electrochem.Commun. – 2010. – V. 12. – P. 296-299.62.Lockett V., Sedev R., Harmer S., Ralston J., Horne M., Rodopoulos T.
Orientation and MutualLocation of Ions at the Surface of Ionic Liquids // Phys. Chem. Chem. Phys. – 2010. – V. 12. –P. 13816-13827.63.Li H., Endres F., Atkin R. Effect of alkyl chain length and anion species on theinterfacialnanostructure of ionic liquids at the Au(111)–ionic liquid interface as a function ofpotential // Phys. Chem.
Chem. Phys. – 2013. – V. 15. – P. 14624-14633.64.Islam M.M., Alam M.T., Okajima T., Ohsaka T. Electrical Double Layer Structure in IonicLiquids: An Understanding of the Unusual Capacitance-Potential Curve at a NonmetallicElectrode // J. Phys. Chem. C. – 2009. – V. 113. – P. 3386-3389.65.Trulsson M., Algotsson J., Forsman J.
Woodward C.E. Differential Capacitance of RoomTemperature Ionic Liquids: the Role of Dispersion Forces // J. Phys. Chem. Lett. – 2010. – V. 1.– P. 1191–1195.66.Vatamanu J., Borodin O., Smith G.D. Molecular dynamics simulations of atomically flat andnanoporous electrodes with a molten salt electrolyte // Phys. Chem. Chem.Phys.
– 2010. – V. 12.– P. 170–182.67.Adelkhani H., Nasoodi S., Jafari A.H. A study of the Morphology and Optical Properties ofElectropolished Aluminum in the Vis-IR region // J. Electrochem. Sci. – 2009. – V. 4. – P. 238246.68.Lin C.C., Hu C.C. Electropolishing of 304 stainless steel: Surface roughness control usingexperimental design strategies and a summarized electropolishing model // Electrochim. Acta. –2008. – V. 53.
– P. 3356-3363.11669.Грилихес С.Я. Обезжиривание, травление и полирование металлов / под. ред. П.М.Вячеславова. – 5-е изд., перепаб. и доп. Л.: Машиностроение, 1983. – 101 c.70.Jacquet P.A. Electrolytic Method for obtaining Bright Copper Surfaces // Nature. – 1935. –V. 135. – P. 1076-1076.71.Elmore W.C. Electrolytic Polishing // J.
Appl. Phys. – 1939. – V. 10. – P. 724-727.72.Хор Т.П. Возникновение и нарушение пассивного состояния металлов // Защита металлов.– 1967. – Т. 3. – С. 20-33.73.Колотыркин Я.М. К вопросу о механизме анодного растворения металлов в условияхпассивности // Сер.хим.наук. – 1959. – №5. – С. 9-22.74.Wagner С. Contribution to the Theory of Electropolishing // J. Electrochem. Soc.
– 1954. –V. 101. – P.225-22875.Shivareddy S., Bae S.E., Brankovic S.R. Cu Surface Morphology Evolution duringElectropolishing // Electrochem. Solid State Lett. – 2008. – V. 11. – P. D13-D17.76.Tian H., Reece C.E. Detailed Nb Surface Morphology Evolution During Electropolishing ForSRF Cavity Production // Proceedings, 15th International Conference, SRF2011, Chicago, USA,– 2011. – THPO038. – Режим доступа:http://accelconf.web.cern.ch/accelconf/SRF2011/papers/thpo038.pdf77.Aylward J.R., Whitener E.M. Dissolution of Zirconium in HCl-Methanol // J.
Electrochem. Soc.– 1962. – V. 109. – P. 87-91.78.Berlouis L.E.A., Schiffrin D.J. Mass transfer effects in the electropolishing of metals // Trans.Inst. Met. Finish. – 1985. – V. 63. – P. 52-55.79.Alanis I.L., Schiffrin D.J. The Influence of Mass Transfer on the Mechanism of Electropolishingof Nickel in Aqueous Sulphuric Acid // Electrochim. Acta.
– 1979. – V. 27. – P. 837-845.80.Pietrowski O., Madore C., Landolt D. The Mechanism of Electropolishing of Titanium inMethanol‐Sulfuric Acid Electrolytes // J. Electrochem. Soc. – 1998. – V. 145. – P. 2362-2369.81.IONMET. New Ionic Liquid Solvent Technology to Transform Metal Finishing. URL:www.eipc.org/ionmet/ (дата обращения 20.05.2011)82.Scionix. URL: http://www.scionix.co.uk/ (дата обращения 20.05.2011)83.Abbott A.
et al. Ionic liquids and their use // Patent US № 0097755. 2004.84.Abbott A. et al. Ionic liquids and their use // Patent US № 7196221. 2007.85.Palmieri V., Mondin G., Rampazzo V., Rizzetto D., Rupp V., Stivanello F. et al. NiobiumElectropolishing by Ionic Liquids: What Are The Naked Facts? // Proceedings, 14th InternationalConference, SRF2009, Berlin, Germany, – 2009. – THOAAU03. – Режим доступа:http://srf2009.bessy.de/papers/thoaau03.pdf11786.Abdel-Fattah T.M., Loftis J.D. Surface Characterization of High Purity Metals of Silver andNickel Electropolished with an Ionic Liquid // ECS Trans. – 2010.
– V. 25. – P. 57-61.87.Uda T., Tsuchimoto K., Nakagawa H., Murase K., Nose Yo., Awakura Ya. ElectrochemicalPolishing of Metallic Titanium in Ionic Liquid // Mater. Trans. – 2011. – V. 52. – P. 2061-2066.88.Тегарт В. Электролитическое и химическое полирование металлов / под.
ред.П.В. Щиголева. – М.: ИЛ, 1957. – 180 c.89.Abbott A.P., Capper G. Voltammetric and impedance studies of the electropolishing of type 316stainless steel in a choline chloride based ionic liquid // Electrochim. Acta. – 2006. – V. 51. –P. 4420-4425.90.Abbott A. P., Capper G. Electropolishing of stainless steels in a choline chloride based ionicliquid: an electrochemical study with surface characterisation using SEM and atomic forcemicroscopy // Phys. Chem. Chem.
Phys. – 2006. – V. 8. – P. 4214-4221.91.Abbott A. et al. Ionic liquids and their use as solvents // Patent US № 7183433. 2007.92.Гришина Е.П., Раменская Л.М., Владимирова Т.В., Пименова А.М. Кинетика анодногоокисления меди в ионной жидкости 1-бутил-3-метилимидазолия бромиде // Журн.
Прикл.химии. – 2007. – Т.80, № 2. – С. 249-252.93.Sathyamoorthi S., Velayutham D., Suryanarayanan V., Noel M. Voltammetric investigations onthe transition between dissolution, passivation and deposition characteristics of Ni, Cu and theiralloys in fluorine based ionic liquid // Electrochim. Acta. – 2011. – V. 56. – P. 7012-7021.94.Aldous L., Silvester D.S., Villagran C., Pitner W., Compton R.G., Lagunas M.C., Hardacre C.Electrochemical studies of gold and chloride in ionic liquids // New J. Chem.
– 2006. – V. 30. –P. 1576-1583.95.Abbas Q., Binder L. Anodic dissolution of refractory metals in choline chloride based binarymixtures // ECS Trans. – 2011. – V. 33, no. 30. – P. 57-67.96.Sasaki I., Murase K., Ichii T., Uchimoto Y., Sugimura H. Anodic Dissolution Behavior ofMagnesium in Hydrophobic Ionic Liquids // ECS Trans. – 2011. – V. 33, no. 27. – P.
65-70.97.Murase K., Sasaki I., Kitada A., Uchimoto Y., Ichii T., Sugimura H. Enhanced AnodicDissolution of Magnesium in Quaternary-Ammonium-Based Ionic Liquid Containing a SmallAmount of Water // J. Electrochem. Soc. – 2013. – V. 160. – P. D453-D458.98.Endres F., Schweizer A. The electrodeposition of copper on Au(111) and on HOPG from the66/34 mol% aluminium chloride/1-butyl-3-methylimidazolium chloride room temperaturemolten salt: an EC-STM study // Phys. Chem.
Chem. Phys. – 2000. – V. 2. – P. 5455-5462.99.El Abedin S.Z., Saad A.Y., Farag H.K., Borisenko N., Liu Q.X., Endres F. Electrodeposition ofselenium, indium and copper in an air- and water-stable ionic liquid at variable temperatures //Electrochim. Acta. – 2007. – V. 52. – P. 2746–2754.118100. Murase K., Nitta K., Hirato T., Awakura Y. Electrochemical behavior of copper in trimethyl-nhexylammoniumbis((trifluoromethyl)sulfonyl)amide,anammoniumimide-typeroomtemperature molten salt // J. Appl. Electrochem.