Delta-80T2-200 (1063519)
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SUSS MicroTec Test Systems GmbHSüss-Strasse 1 · D-01561 Sacka b. Dresden · GermanyPhone (+49)-(0) 35240-73-0 · Fax (+49)-(0) 35240-73-700SUSS MicroTec S.A.Avenue des Colombières · F-74490 Saint Jeoire · FrancePhone (+33)-(0) 4 50 35 83 92 · Fax (+33)-(0) 4 50 35 88 01Mask AlignersSUSS MicroTec Lithography GmbHSchleissheimer Str. 90 · D-85748 Garching b. München · GermanyPhone (+49)-(0) 89/3 20 07-0 · Fax (+49)-(0) 89/3 20 07-162Subject to change without prior noticeEUROPESpin CoatersSUSS MicroTec Laboratory Equipment GmbHJosef-Schuettler-Str. 2 · D-78224 Singen · GermanyPhone (+49)-(0) 7731-185-0 · Fax (+49)-(0) 7731-195-130SUSS MicroTec Ltd.Hogwood Ind. Estate, 23, Ivanhoe RoadFinchampstead, Wokingham, Berkshire RG40 4QQ, EnglandPhone (+44)-(0) 1189-732144 · Fax (+44)-(0) 1189-734395NORTH AMERICASubstrate BondersSUSS MicroTec Inc.228 Suss Drive · Waterbury Center, VT 05677 · USAPhone (802) 244-5181 · Fax (802) 244-5103SUSS MicroTec Inc.Wester Regional Sales Offive, 8240 So.
Kyrene Road Suite 101Tempe, AZ 85284-2117Phone (+1) (480) 557-9370 · Fax (+1) (480) 557-9371ASIASPIN COATERSJAPANGYRSET®SUSS MicroTec KKGITC 1-18-2, Hakusan, Midori-ku, Yokohama, Kanagawa, Japan 226-0006Phone (+81)-45-931-5600 · Fax (+81)-45-931-5601www.suss.comwww.suss.comProbe SystemsSUSS MicroTec AGShanghai Office580 Nanjing W. Rd · Nanzheng Building Room 606 · 200041 ShanghaiPhone (+86) 21-52340432 · Fax (+86) 21-52340430DELTA 80, WeAl, 08/2002, #1SUSS MicroTec AGTaiwan Representative Office8F-11, 13 · No. 81 · Shui-Lee Road · Hsin-Chu · 300 · TaiwanPhone (+886)-(3) 5169098 · Fax (+886)-(3) 5169262Flip Chip BondersSUSS MicroTec Company Ltd.3388/92-93 · 25th Floor · Sirinrat Bldg.Rama IV Road · Klongtoey · Bangkok 10110 · ThailandPhone (+66)-(0) - 2350 6038 · Fax (+66)-(0) -2633 5728Features and Benefits■ Multi size configuration with automaticGYRSET® cover size detection and spinspeed limitation set up provide the flexibility to meet all major application typesGYRSET®Universal 8” Coating System /Advanced Spin Coating■ GYRSET® quick exchange system, allowsfor easy change over between wafersizes.■ The process bowl made of polypropyleneis easily removed for cleaning the processchamber■ Wafer size up to ø 8” (ø 200mm) and substrates up to 6” x 6” (150 x 150mm)The DELTA 80 is the newest SUSS Spin Coaterbased on the well known SUSS patented GYRSET®closed cover coating technology.
It combines stateof the art technology with innovative excellence.The DELTA 80 can process delicate wafer fragments, wafers up to ø 8” (ø 200 mm) or substratesup to 6” x 6” (150 x 150 mm).■ Spin speed from 1 up to 10.000 rpm(depends on GYRSET® size or Open Bowloption)The unique design of the DELTA 80 process chamber provides a better uniformity than conventionalopen bowl spin coaters. At the same time it can significantly reduce resist consumption up to 60% forresists like Cyclotene™ (BCB) compared to conventional Spin Coating systems. The Delta 80 is alsothe ideal tool for coatings over high topography■ Storage of 20 recipes with up to 40 stepsat each recipe or unlimited numbers ofrecipes storable with laptop optionBetter uniformity and less resist consumption makethe SUSS DELTA 80 Spin Coater the ideal toolregarding the cost of ownership.■ Fully programmable process parameterswith easy to use keyboard and clear textdisplay■ For the programmable dispense arm different resist pumps, syringe systems andmedia nozzles for accurate and precisedispense are availableFeatures And Benefits■ Modular design, the ability to mount themodules into a wet bench or a standalone stainless steel cabinetGyrsetThe SUSS DELTA 80 Spin Coater is simple to operate with fully programmable process parameters.The system is available as a bench mounted module (BM) or for stand alone (T version) operation integrated into an attractive stainless steel cabinet.
Avariety of options are available.Spin Coaters■ Uniform coatings with the SUSS patentedGYRSET® technology, reduced resist consumption and less edge build-up are theguarantee for very high quality processand repeatability, especially on square orrectangular substrates23■ Chuck indexing for positioning the chuckaccurately at the same position for easyload / unloadBENEFITS OF OWNERSHIPPhotoplastic gear, 450 µm high SU-8 resistCourtesy: SFIT (EPFL) and IBM (CH)■ Si and GaAs wafers and substrates■ Polyimide/SOG/adhesive promoters■ Microsystem technology■ Rectangular substrates■ Flat panel display (passive, active,plasma, FED)■ Positive/negative photoresist■ Concave and convex lenses■ Photomasks■ Photocells■ Compact disks (ROM, audio, video)■ Glass mastering with thin layer coating■ Optical lenses, encoders, scales■ X-ray masks■ Bumping applications for flip chipPhotoresist pattern of 57 µm thicknessTHE GYRSET® SYSTEMSUSSGYRSET®A Wise Investment■ Reliable, consistent and uniform materialapplication at lower spin speeds■ Economic ownership costs including lowerresist consumption and reduced wastedisposal expenses■ Service that is a cornerstone of ourproducts and our reputation in the industry■ Highly reproducible thick resist applications■ Uniform coverage even over severe topography■ A wider range of resist thicknesses requiringfewer resist types■ Warranty backed by SUSS with multipleworld-wide locations■ Technology unsurpassed inthe industry todayNiFe rotor element, 85 µm high, singleshot coating100AZ® 4620AZ® 462010AZ® 4330AZ® 4330AZ® 4110AZ® 41101,0GYRSET Closed Cover System0,15001000150020002500Substrate4000500060007000®ConventionalCoating SystemGYRSET® SystemGYRSET® gives youmore uniform coating,even on piecesConventionalCoating SystemGYRSET System®Solvent saturated atmosphereCompound chuckGYRSET® system designUp to 60% less resist consumption with GYRSET®.With the same quantity of resist (0.55 ml BCB),cover the whole of substrate.Benefits Of OwnershipT e Pate ded Solutio4Turbulence flow3000 3000Speed rpmGYRSET offers an order of magnitude wider range at lowerspin speedsThe patented SUSS GYRSET® system is based ona simple but revolutionary concept.
Compared to aconventional spin coating system it has multiple unparalleled advantages. The GYRSET® system offersbetter uniformity and up to 60% resist cost saving(depending on resist).The GYRSET® system with indexed bell-shapedcover excludes air turbulence inside the processchamber. This technique yields a uniform, consistentcoating thickness without the usual spinning defects(no rebounding, no splashback, no striations, nocomets, no corner effects).Because of the solvent-saturated atmosphere insidethe process chamber, less resist dry skin effectoccurs.
Consequently, better uniformity and processcontrol for thick as well as for thin resist layers areproduced.Conventional Open DesignSpin CoatersThe SUSSIs Capable Of Processing:Thickness µmTHE PATENTED SOLUTION5Spin CoatersSIMPLE AND FLEXIBLE5” high profile and 5” standard profile GYRSETSMulti-Size GYRSET®The DELTA 80 can be equipped with three differentGYRSET® sizes: 2” up to 8”. The configuration isautomatically detected and the maximum speed setaccordingly. With a change over time of less than 5minutes, the SUSS DELTA 80 GYRSET® is the mostflexible and upgradeable coater on the market.Multi-Profile GYRSETSSelect the GYRSET® height according to the thickness of your substrate.
Use the table below to helpyou choose the correct size.Choose between a fixed or quick exchangeGYRSET® plate. Easily removable for cleaning, thequick exchange GYRSET® plate is simply lockedby magnet to the hub.8” Quick Exchange GYRSET®Simple a d Flexible7 000 rpm6Delta 80 GYRSET 35 000 rpmDelta 80 GYRSET 5Interchangeable GYRSET® Systems for 2” up to 8” parts3 000 rpmDelta 80 GYRSET 8STANDARDHIGH(Fixed or Quick Exchange)(Fixed or Quick Exchange)Maximum SubstrateThickness (mm)Maximum SpinSpeed (rpm)Maximum SubstrateThickness (mm)Maximum SpinSpeed (rpm)Delta 80 GYRSET 843 000123 000Delta 80 GYRSET 555 000123 000Delta 80 GYRSET 357 000123 000Simple and FlexibleFixed And Quick Exchange7MODULAR OPTIONSThe DELTA 80 can be configured with two differentdispense arms, either fully programmable electronicdispense or pneumatic driven dispense arm.The programmable electronic dispense arm provides more flexibility.
It is fully programmable inspeed, acceleration and position and can be equipped with up to 6 media lines - maximum 4 resistlines and 2 solvent lines. It is also possible to fit theedge bead remover, nitrogen blow or bowl autoclean option.The pneumatic dispense arm can be equipped withonly one resist line and has only two positions,home and dispense position.SIMPLE AND FLEXIBLEDouble Side (LC)* AndSingle Side ChucksSpin CoatersDispense Arms (Options)Choose either double or single side chucks in 8”, 2”or smaller sizes.
The substrates are vacuum-lockedduring processing. The vacuum patterns, supportpins and locating pins are designed according to yourcomponents and adapted to the options chosen.3” Double Side ChuckAdapters For Small PiecesAvailable for single side chucks, these adapters allowyou to process pieces up to 2” on a larger size chuck.8*Low Contact3” Single Side Chuck with AdapterModular OptionsSimple A d Flexible3” Single Side Chuck9Spin CoatersResist Nozzle Autoclean OptionElectronic Dispense Arm and Chuck Lift (up position)Edge Bead Remover (Options)Cotton Candy Remover (Options)Resist Nozzle Auto Clean (Options)Chuck Lift (Options)This fully programmable option removes the resistbuild-up at the edge of the wafer.
All tubing valvesand flowmeters are included. Wafers up to 8”(200mm) in diameter can be processed.This programmable solvent nozzle dispenses solvent onto the GYRSET® cover to remove stringers(cotton candy). It also cleans the process chamberbefore the process stops.It provides excellent results and reduces substratecontamination due to cotton candy effects.This fully programmable option injects solvent ontothe required dispense nozzle dissolving any residueand cleaning the inside of the nozzle.Allows easy loading and unloading of the wafercombined with the standard chuck indexing forrepeatable wafer positioning.Dispense Systems (Options)Laptop (Options)Different high and low viscosity photo resist pumpsare available.
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