BR_Gamma_2012_V1 (1063511), страница 2
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A MEMS wafer is preparedhaving a plurality of MEMS structure sites thereonand it can consist of different shapes andmaterials. SUSS Gamma coaters allow for flexibleadaption to the various special handlingrequirements. Double side structured, warpedand bowed wafers down to 200μm thicknesscan be easily accommodated.
Reduced operatorintervention and a minimum number of handlingsteps reduce the stress that MEMS substratesare subjected to during lithography processing.SoftwareThe production proven software is installed inmore than 400 systems worldwide. It offers indepth process control as well as the necessaryflexibility to match the fast changing requirementsof today’s production.
The control software isbased on Windows XP and is shared with allother automatic SUSS coating platforms.The user interface graphically shows the currentstatus of the whole machine. For service purposeseach connected module can be accessedindividually. Machine operation is intuitive andeasy to learn. The location and status of eachwafer in the machine is displayed in real time.Module controller components and softwareare based on a common design for convenientserviceability.
Process recipes and flowsequences are generated with point and clickease. The sequence cascading feature enablescontinuous substrate flow, even in case of+ Indication of level for all chemicals+ Visualization and status of wafers+ Icons for each module+ Fully programmable user levels+ Instant access to all monitored currentanalog & digital module parameters+ E95 compatible touchscreen optionsubsequent sequence change.
The sequencestacking option allows for repeated automaticprocessing the same wafer batch. The operatorcan run multiple process flows, multiple recipesand multiple substrate sizes simultaneously. Hecan e. g. run one cassette of wafers in a coatingsequence while running another one in a developingcycle. Online and offline sequence editing arepossible even during operation. Detailed toolprotocols facilitate wafer tracking.
A host interface is available which is compliant to SECS /GEM (Semi E5/E30).Available software options+ Simple recipe path editing+ Modules are edited to the path+ Simply drag and drop module icon into path+ Each “module slot” with its own icon++++++++++++++++Sequence cascadingRecipe stackingParallel flowScheduling modeUp to 10.000 sequencesSECS/GEM interfaceConvenience buttonsOffline simulation including recipe creation9Examplary Configurations of the Gamma ClusterCenteringStationoptional withFlatfinderCenteringStationoptional withFlatfinderTemperatureoptionalHMDSHotplateCoolplateTemperatureoptionalHMDSHotplateCoolplate12301230CoateroptionalDeveloper1850optionalCoaterDeveloperTemperatureI/O1330DeveloperoptionalCoaterTemperatureFootprint of SUSS Gamma Ppatform with 4 moduleconfiguration;e.g.
spin coater, developer and temperature stackCenteringStationoptional withFlatfinderCoateroptionalDeveloperFootprint of SUSS Gamma platform with 2 moduleconfiguration;e.g. spin coater and temperature stackCoateroptionalDeveloperTemperatureSpray CoateroptionalCoaterDeveloperTemperatureoptionalHMDSHotplateCoolplateCoateroptionalDeveloperTemperature14901500SprayCoaterI/ODeveloperoptionalCoater1850I/OTemperatureoptionalHMDSHotplateCoolplateFootprint of SUSS Gamma platform with 4 moduleconfiguration;e.g.
spray coater, developer and temperature stack1850DeveloperI/O +DeveloperoptionalCenteringoptionalCoaterStationCoaterTemperatureTemperatureFootprint of SUSS Gamma platform with 5 moduleconfiguration;e.g. spin coater, developer and temperature stackOther configurations on request10technical dataclusterSubstrate Size2” to 8“ round, 2” to 6” squareSubstrate HandlingFully automatic, open cassetteOption: substrate edge handling, bow wafer handlingSubstrate ProcessingFully programmable random access clusterUser InterfaceWindows XP; graphical user interfaceMax.
# Coat Modules4 (scalable system)Max. # Develop Modules4 (scalable system)Max. # Temp Stacks4 (up to 7 HP/CP)Max. # of Recipes> 1000 module recipesOptional 5th Moduletemp stack only (up to 7 HP/CP)coat and develop modulesSpin Speed Control±1 rpm with digital spin motor controllerCoater# of Dispense Lines4 standard ( max. 3 with optional independent temperature control up todispense tip)OptionsEdge bead removal and back side rinsePre- and dummy dispenseGYRSET® or open bowl processesSpin motor flange temperature controlDevelop ChemistriesModules designed for aqueous or solvent based developingDeveloper DispenseOptional binary spray, fan spray or stream/puddle dispensesCleaner DispenseMegasonic or high pressureSpray Coat Moduleconfigurable with up to 2 independent spray dispense systemsoven stack moduleshot plateHot Plate TemperatureUp to 250°CTemperature Uniformity±0.5°C up to 120°C±1% >120°CBake MethodFixed and programmable proximityOptions: electrostatic charge control for pyroelectric wafers; top side heatingcool plateCool Plate Temperature15 to 30 °CTemperature Control± 0.2 °CCool MethodFixed and programmable proximityOption: electrostatic charge control for pyroelectric wafersVapor PrimeVapor Prime TemperatureUp to 250 °CPriming MethodVapor injection via nitrogen bubbler processutilitiesVacuum– 0.9 to -0.7 barClean Dry Air6 to 8 barNitrogen6 to 8 barPowerConfiguration dependentData, design and specificationof custom built machinesdepend on individual processconditions and can varyaccording to equipmentconfigurations.Not all specifications may bevalid simultaneously.
Illustrationsin this brochure are not legallybinding. SUSS MicroTecreserves the right to changemachine specifications withoutprior notice.11North AmericaEuropeASIAYokohama, JPHwaseong City, KRSunnyvale, USGarching, DESternenfels, DENeuchâtel, CHLyon, FRCoventry, UKSingapore, SGShanghai, CNHsin Chu, TWVisit www.suss.com/locations for your nearest SUSS representative or contact us:SÜSS MicroTec AG | Phone: +49 89 32 007 0 | info@suss.comwww.suss.comGamma · 01/2012 · BR_Gamma_2012 · V1HeadquartersProductionSales.
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