BR_Gamma_2012_V1 (1063511)
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Gammaautomatic coat / develop clusterAutomatic coat / Bake / develop clusterThe SUSS Gamma systems are fully automaticcluster tools that address the needs forflexible, clean, and reliable coating processeswith photoresist, BCB, BPO or polymide.2The systems are capable of combining highthroughput with a low cost-of-ownership, thereforemaking them perfect tools not only for the SUSSkey markets Advanced Packaging (ADP) andMEMS, but also for the opto semiconductorindustry.With its compact, robust and flexible design theGamma meets the requirements of advancedlaboratory/pilot production as well as volumeproduction on an extremely small footprint.The system can be equipped with modules forspin or spray coating, cleaning, developing,baking, priming and cooling.Gamma systems aredesigned to maximizeperformance at thelowest cost of ownershipfeatures and benefits++ Compact cluster architecture with central++++++++++++robot and radially distributed processmodulesUp to four spin/develop cupsUp to three temperature stacks with each upto seven Hot/Cool/Vapor Primin platesAltaSpray module for topography coatingSUSS Cassette Auto-Sizing™ with zeromechanical changeover between differentwafer sizesFlexibility to handle various substrate sizes from 2“ up to 8“ round and from 2“ up to 6“squareParallel flow functionality even with differentwafer sizes for optimized machine utilization++ GYRSET® rotating closed cover coating++++++++++++technologyFringe free coatings of square substratesPrecision edge bead removalStream and spray dispenses for highly uniformresist developmentFully equipped SECS II/GEM interfaceoptionSEMI F47 compatibility (voltage sag immunity)SEMI safety and ergonomic standards S2,S8, S14 are optionally applied includingthird-party certification3Photo-BCB dielectrics, Cu,BCB, Cu, cross section forplanarization of photo BCB7.8 micron of BCB coatingConformal topography coverage withSUSS AltaSpray coating technology.Achieved with AZ4999 positive resistSUSS Gamma cluster: More than just a PlatformSUSS Gamma coat and develop systems areable to handle a huge range of different substratematerials, sizes and forms.Thereby the Gamma cluster is designed to showexcellent uniform results for a variety of applications such as conformal topography coating,planarization and thin and thick resist coatings.Gamma systems are designed to maximizeGYRSET® Systemwith GYRSET®performance at the lowest cost of ownership.The patented SUSS GYRSET® rotating closedcover coating technique can be optionallyintegrated into the Gamma spin coating module.For various photoresists and applications GYRSET®enables substantially reduced materialconsumption, wider process window, and abetter overall performance potential.
Squaresubstrates can be coated without fringes all theway to the corners. In addition Gamma clustersystems are designed for the most flexibleadoption to the various special handlingrequirements. Double side structured, squareor rectangular, ultra-thin and warped substratescan be accommodated, making it the tool ofchoice for MEMS applications.Conventionalwithout GYRSET®4Turbulence free coating using GYRSET®allows uniform resist thickness even to thecorner of substratesGamma Coating/Developing examplesLithography processes for Advanced Packagingusually require processing of thick resists(positive resists, PBO or Polyimide).
The SUSSGamma coater assures the best uniformity andcoating quality when applying thick layers to thesubstrate. Advanced dispense system set-upsfor viscosities of up to 50.000 cP for bubble freedispense and tightly controlled dispense volumeas well as precision suck back ensure superiorcoating uniformity and quality. The electronicdispense arm with SUSS MicroTec designeddrip free EBR needle allows for high precisionedge bead removal.After exposure (on a SUSS Full-Field MaskAligner) an assortment of dispense options isemployed for developing the exposed films.Binary spray, fan spray or stream/puddledispenses are standard configuration options.Both aqueous and solvent based chemistriescan be accommodated. The dispense arms areprogrammable in height for best spray geometry.For optimal CD uniformity control, the user candefine individual arm sweep patterns in eachrecipe.HD4000 series polyimide,c oa te d , e xp ose d a nddeveloped by SUSS MicroTec(200 mm wafer).
After curingan ideally tapered profilewithout crowning is obtained.Mean thickness: 10.5 μm, uniformity: 2.2%75 μm JSR THB 151-N,negative acting resist coatedusing a single dispense on a200 mm wafer, ± 3.4% uniformity across waferTOK PMER PLA900 positiveacting resist, coated, g-lineexposed and developedby SUSS MicroTec. Afterdevelop an ideal profile forAu bumping is obtained. Thefilm was coated on a 150 mmwafer with a mean thicknessof 24.5 μm, and a uniformityof 1.8%5The Gamma Process Flow: Modules for multiple ApplicationsThe Gamma system can be equipped withmodules for spin and spray coating, developing,hard bake, HMDS vacuum priming, soft bakeand cooling. Thereby combined with a SUSSMask Aligner covering the complete lithographyprocess.Spin Coating ModuleFor spin coating, both open bowl and GYRSET®rotating closed cover systems are available. Thespin coating modules have brushless spinmotors with a speed accuracy of better than1rpm.
To prevent thermal influences the motorflange can be temperature controlled.Due to the airflow design in the GYRSET® coatbowl, different wafer sizes can be processedwithout the need for any mechanical changeover.Wafer sizes are automatically recognized in themachine and flow sequences with differentsubstrate sizes can be run concurrently.Robot End Effector6Spin CoaterSpray CoaterEach coater module can handle a large varietyof photoresists and solvent dispenses such asprewetting and edge bead removal.
Resist linescan be individually temperature controlled foroptimized thickness uniformity control. Dispenseoptions include the use of pneumatic andstepper-motor driven dispense pumps, pressurizedsystems and programmable syringe dispensesystems for volume production as well as forR & D and small scale production.AltaSpray Coating ModuleFor surfaces with severe topography, resistfilms tend to pull away from exposed edgesand accumulate in trenches.
Equipped withSUSS’ proprietary spray nozzle, the newpatent-pending SUSS AltaSpray coat processallows reliable coverage of structures with hightopography and enables successful photolithographic patterning of features on top, on thebottom as well as across the structures.HCV Oven Stack with hot and cool platesOven StackInput / Output Module (I/O)Each oven stack can be individually configuredwith plates for baking and chilling of wafers aswell as for vapor priming. Telescopic railspermit easy access to the bake plates forcleaning and maintenance.
Proximity bakeprocesses are carried out using either fixedposition ceramic balls or motorized programmablelift pins. For best bake results the hot plates areequipped with individually adjustable exhaustand nitrogen purge. Vapor priming is accomplishedusing injection of HMDS in a nitrogen carrier gas.The Gamma I/O cassette station accommodatesround wafers from 2“ up to 8“ and square substrates from 2“ up to 6“. Customer specific sizescan also be accommodated.Different wafer sizes can be processed concurrentlywithout any mechanical changeover due to theSUSS Autosizing™ Feature.
Restrictions in sizevariations apply to ensure safe spin processing.A software interlock assures that any processsequence is carried out only for the correctlyassigned substrate size. Substrate cassettesare scanned to detect the occupied positions inany loaded cassette.Substrate centering is accommodated by eitherusing the mechanical or the optical SUSSUniversal Centering Station.Developer ModuleThe developer module is available for aqueous orsolvent development. Depending on the applicationthe user can choose within a large selection ofnozzles such as puddle, spray or high pressure.At the end of the developing process the user canchoose between front side and back side rinseand nitrogen drying. To optimize the process resultthe module can be equipped with a motorizeddeveloper dispense arm.
In combination with theSUSS specific variable arm movement function itallows any user-defined sweep pattern for dispensing developer liquid across the wafer. For a higherreliability and throughput the developer media linescan optionally be temperature controlled.Exposure on a SUSS Mask AlignerDeveloperChemical SupplyThe compact design with separation of electricalfrom chemical handling components allows forstorage of chemicals within the machine enclosure.For more complex applications that requireautomatic tank switching and central filling oftanks, various external chemical supply cabinetoptions are offered.HCV Oven Stack with hot and cool plates7Spin Coating Solutions for MEMSEdge handling end effectorfor robot handlerCentering station with flatfinder for edge handlingCoater chuck with edgehandling and integrated backside rinseAqueous developer chuckwith edge handling and backside rinseSolvent developer chuck withedge handling and back siderinse8Fabricating the many different varieties of microelectromechanical systems (MEMS) poses complexprocessing challenges, particularly in thelithography area.
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