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Tanks can be filledmachine frame. With a separate EFEM the ACS300 Gen2from a central media supply. Automatic tank and bottlecan be equipped with up to four load port modules, whichswitching enables continuous operation. The media sup-offer integrated wafer mapping and can be used withply is configurable for a large variety of media combina-standard FOUPs or FOSBs.tions.Depending on the system configuration a larger numberFull bridge capability is ensured by cassette adapters thatof tanks and resist bottles can directly be installed in theallow handling 200 mm wafers.
The ACS300 Gen2 offerschemical compartments of the process modules. This guarthe flexibility of simultaneous 200 and 300 mm waferantees for short dispense lines to the point of use which isprocessing without mechanical changeover.of particular importance for high viscosity material.0Intuitive GUI Design•••••Level indication for all chemicalsVisualization and status of wafersIcons for each moduleProgrammable user levelsInstant access to all current analog & digitalmodule parametersEnabling ControllerTechnologyThe production proven software of the ACS300 Gen2 offers the most up-to-date controller technology availablein the market. The system is based on Windows XP operating system combined with Multi Module Controller(MMC) software.It provides a user interface that graphically shows thecurrent status of the entire machine.
For service purposes each module can be accessed individually. Machineoperation is intuitive and easy to learn. The location andstatus of each wafer in the machine is displayed in realtime. Module controller components and software arebased on a common design for convenient serviceability.Process recipes and flow sequences are generated withpoint and click ease. The sequence cascading featureenables continuous substrate flow, even in case of sequence change.
The operator can run multiple processflows, multiple recipes and multiple substrate sizes simultaneously. He can, e.g. run one cassette of wafers in acoating sequence while running another one in a developing sequence. Online and offline sequence editing and0• Simple sequence / recipe path editing• Simply drag and drop module icon into path• Each “module slot” is represented by an iconprocess simulation are possible even during operation.Detailed protocols and E10 states facilitate wafer andtool tracking. A host interface is available which is compliant to SECS-II/GEM (SEMI E4/E5/E30/E37) and 300 mmcommunication standards (SEMI E40/E87/E90/E94 andE116 states).LithoPack300Integrated Coat, Bake, Expose, Develop SolutionThe SUSS LithoPack300 is a dedicated lithography toolThe MA300 features a dedicated alignment kit for creat-for wafer-level packaging of 200 mm and 300 mm wafersing 3D interconnects for applications like chip stackingwith coat, bake, expose and develop modules.and 3D image sensor packaging.It allows quick changeover between 200 mm and 300 mmFor more details please refer to the MA300 brochure.wafers and is the integrated lithography solution for bothintegrated device manufacturers as well as foundries.With the next generations of both the ACS300 coat / develop cluster as well as the MA300 mask aligner SUSSMicroTec now offers an unprecedented integrated andmodular lithography solution.MA300 Gen2 ModuleThe MA300 Gen2 exposure unit is a 300 mm 1X Full-Fieldproximity mask aligner that enables wafers to be exposedin a single step, enabling the printing of special featuresat the wafer periphery without compromising on highthroughput.
This is an important advantage of the maskaligner over stepper technology especially when subsequent metallization of bumps or redistribution traces is tobe carried out using an electroplating process.LithoPack3000ACS300 Gen2The ACS300 Gen2 is a modular cluster system that canbe individually configured from a construction set offrame components and process modules to perfectlymatch your processing and productivity requirements.The scalable system architecture with field-upgradableprocess modules guarantees full flexibility from the R&Dstage to high volume production.Construction set:I/O Modules2x I/Omodule4x I/OmoduleACS300 GEN2FRAME COMPONENTSBasic frame forup to 4 processmodulesFrame extension for up to2 HCV stacksMA300 GEN2Mask alignerExemplary configuration:10ACS300 Gen2:4 module configuration with2x I/O module and frameextension for 2 HCV stacks.ACS300 Gen2:8 module configuration with4x I/O module.LithoPack300:ACS300 Gen2 with 4 processmodules, 2x I/O module andMA300 Gen2 mask aligner.technical dataGeneral featuresSubstrate size200 mm and 300 mm roundOption: square and rectangularSubstrate handlingFully automatic FOUP, FOSB, open cassette, SMIF and factory automation optionsSubstrate processingFully programmable cluster toolUser interfaceWindows XP operating system with SUSS MMC softwareMax.
# spin modules> 8 (scalable system)Max. # HP/CP ovens> 24 (scalable system)Max. # of sequences10000Max. # of recipes1000 with 50 steps (on spin processes) eachcoat and develop modulesSpin speed control±1 rpm with digital spin motor controller# of dispense linesUp to 3 temperature controlled resist dispense lines per dispense armOptionsLarge selection of pumps and dispense systemsEdge bead removal and back side rinseControlled flow metersProgrammable exhaustSpin motor flange temperature controlFilter fan units or local cleanroomWafer Edge ExposureDevelop chemistriesModule designs for aqueous and solvent based developingDeveloper dispenseStream / puddle, binary spray and fan sprayoven stack moduleshot plateHot plate temperatureUp to 250 °COption: Up to 350 °CTemperature uniformity± 0.4 °C up to 120 °C± 1 % >120 °CBake methodProgrammable proximity with fixed minimum proximitycool plateCool plate temperature15 to 30 °CTemperature control± 0.2 °CCool methodProgrammable proximity with fixed minimum proximityvapor prime FeaturesVapor prime temperatureUp to 250 °CPriming methodHMDS vapor primeutilitiesVacuummin.
– 0.8 bar, +/- 5 %Compressed Dry Air8 bar, +/- 10 %Nitrogen8 bar, +/- 10 %DI water3 bar, +/- 10 %PowerConfiguration dependentData, design and specification of custom built machines depend on individual process conditions and can vary according to equipment configurations. Not all specificationsmay be valid simultaneously. Illustrations in this brochure are not legally binding. SUSS reserves the right to change machine specifications without prior notice.11JH/WM · 03/2009ACS300 Gen2 · DE · 03/ 2009 · #1 · 2000 Serving Our CustomersWith more than 8,000 systems installed worldwide, SUSS MicroTec is amongst the leading suppliers of process and test equipment forthe semiconductor industry. Our commitment to superior performance and cost-effective solutions has made us a technology leader aswell as a reliable partner for R&D and manufacturing.Throughout the world dedicated and highly trained service teams support our customers with routine maintenance, training and fieldupgrades.
Our service record is what we are continuously acknowledged for with customer satisfaction awards – we are there for you!Visit www.suss.com/locations for your nearest SUSS representative or contact us:SUSS MicroTec AG | Phone: +49 89 32007 0 | info@suss.comwww.suss.com.
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