BR_ACS300Gen2_2009_lores (1063502)
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ACS300 Gen2The Coat Develop SolutionFrom Pilot to High Volume ProductionACS300 Gen2The Powerful Coating Solution for 300 mmThe ACS300 is a modular coat and develop cluster cov-The ACS300 Gen2 has been designed as modular andering wafer sizes from 200 to 300 mm without the needscalable system solution with field-upgradable processof mechanical changeover as well as square substrates.modules which allows for flexible production planningThe system offers superior performance in coating, bak-from R&D or pilot production to high volume productioning and developing wafers for applications such as thinstages.
It can be interfaced with the SUSS MA300 Gen2and thick resists, or photosensitive polymers like poly1X Full Field Proximity Mask Aligner to form the integratedimide or Cyclotene™ (BCB). With its best in class coatLithoPack300 cluster.and develop uniformity and an exceptional edge beadperformance the ACS300 Gen2 is the dedicated cost-With the ACS300 Gen2 SUSS MicroTec has designedeffective resist processing solution for the Advanced Packa flexible, cost-effective coating cluster solution that sup-aging market.
The ACS300 series from SUSS MicroTecports a variety of different manufacturing requirements asalready has a large installed base with foundries, IDMswell as equipment extendibility for multiple device gener-and R&D institutes worldwide.ations.Features and benefits+ Highly flexible resist processing cluster for high-volume production+ Concurrent 200 and 300 mm wafer processing without mechanical changeover+ Scalable and field-upgradable cluster architecture+ GYRSET® closed bowl coating technology for reduced resist consumption+ Best in class edge bead performance through combination of precision edge bead removal andsophisticated chuck and bowl design+ Customized solutions for handling standard and non-standard substrates such as stacked and warped wafers+ 6-axis robot for handling a wide range of substrates including carrier solutions0+ Interface to 1X Full Field Proximity Mask Aligner MA300 Gen2The Dedicated System for the Advanced Packaging MarketThe ACS300 Gen2 is the dedicated solution for the Advanced Packaging Market serving applications like solderbumping, gold bumping, as well as front side Redistribution Layers (RDL) used in Wafer Level CSP or backside RDLfor 3D Packaging.
The GYRSET® technology allows for coating thicknesses in the range of below 1 µm to over 100 µm:ACS300 Coating Results:AZ1505JSR WPRAZ10XTHD-4000Positive tone photoresistPhotosensitive dielectricPositive tone photoresistPolyimideTest Diameter:290 mmTest Diameter:296mmTest Diameter:288mmTest Diameter:284mmMean:0.90 µmMean:7.94µmMean:12.5µmMean:17.1µmStd. Dev.:0.30 %Std. Dev:0.30%Std. Dev.:0.46%Std. Dev.:0.31%Hi/Lo Variation:0.90 %Hi/Lo Variation:0.71%Hi/Lo Variation:1.05%Hi/Lo Variation:0.78%TOK PMER P/CA1000PMAZ40XTJSR THB 151-NJSR THB 151-NPositive tone photoresist,Positive tone photoresistNegative tone photoresistNegative tone photoresist,chemically amplifieddouble coatingTest Diameter:294 mmTest Diameter:290mmTest Diameter:295mmTest Diameter:294mmMean:20.6 µmMean:43.5µmMean:72.0µmMean:122µmStd.
Dev.:1.03 %Std. Dev.:1.36%Std. Dev.:1.31%Std. Dev.:1.36%Hi/Lo Variation:2.57 %Hi/Lo Variation:2.74%Hi/Lo Variation:3.95%Hi/Lo Variation:3.51%AZ1505:Redistributed chip package with four20 µm/5 µm gold bump line/spaceExposed and developed via patternstacked copper layers. Planarizationpattern. TOK PMER P/CA1000PMwith opening diameter of 3 µmlayers formed with Rohm & Haascoating on ACS300 Gen2. ExposedInterVia™ Photodielectric 8010-60.with MA300 Gen2.0The ExpertFor Thick ResistProcessingThe challenges of photoresist processing in the field ofwafer bumping, wafer level packaging and 3D packagingrequire a very careful design of coat, bake, develop modules in order to obtain optimum processing results. TheACS300 Gen2 is designed to produce resist coatingswithin a thickness range from less than one to over 100microns.
Thick resists require coat module geometriesthat can handle the high viscosities involved and yieldthe wafer during the bake. When utilizing such carefulhighly uniform films.bakes, uniform solvent content in the photoresist prepares the substrate for subsequent exposure and develop steps.Thick Resist CoatingThe ACS300 Gen2 is a master when it comes to processing of ultra-thick resists which often involves spinning theThick Resist Developmentmaterial at speeds below the optimum dynamic spinSUSS MicroTec has incorporated features allowing highlyspeed range. The ACS300 Gen2 offers contaminationuniform resist development with lowest media consump-control and automated cleaning capabilities which is oftion and shortest process times. The developer chemis-particular importance when processing high viscositytry can be heated in a controlled fashion and is applied tomaterial.
The combination of precision edge bead remov-the wafer by a large assortment of optimized dispenseal and an optimized chuck / bowl design guarantees bestnozzles. The dispense pattern is controlled by of user-in class edge bead performance.definable dispense arm sweeps including variable ratearm movement. Recipe-programmable z-height of theThick Resist Bakingdispense arms is applied for optimization of develop me-For superior bake performance with ultra-thick photore-dia impact and wafer coverage.
For the development ofsists the ACS300 Gen2 enables fully programmablethin photoresist and other polymers, the ACS300 Gen2proximity bakes which allows for optimizing bake timeshows exceptional uniformity and stability due to mediaversus temperature. Highly symmetric exhaust and purgeflow, spin speed and point-of-use temperature control.geometries guarantee for uniform solvent removal acrossACS300 Gen2 Application OverviewSOLDER BUMPINGGOLD BUMPINGFRONTSIDE RDLBACKSIDE RDLPhotoresistCoat & DevelopCoat & DevelopRe-routing LayersLithographyfor 3D PackagingDry FilmDevelop0Polyimide forRepassivationDielectrics(e.g.
Polyimide, PBO, BCB)Enabling GYRSET® Coating TechnologyThe GYRSET® rotating closed cover coating process en-First, the flow above the wafer does not get turbulent,ables a unique turbulence-free and solvent rich atmos-since the wafer is protected from the outside air. Second,phere above the substrate during coating, thereby sig-the spin speed required to cast a certain film thickness isnificantly reducing the influence of ambient temperaturelower when coating in a closed bowl process as com-and humidity on the processing results. As the materialpared to open bowl coating. Third, as the materialstays wet for an extended period of time, its surface wet-remains wet for an extended period of time compared toting capability remains high and therefore the amount ofopen bowl coating, its surface wetting capability remainsmaterial required to coat a wafer can be substantially re-high and consequently the material required to coat aduced.wafer can be substantially reduced.Photoresists designed and qualified for 200 mm do notalways work well for 300 mm, since the required spinspeeds are above the limit tolerable for laminar air flow.This causes fringes and non-uniformity at the wafer edgefor spins above a critical speed limit.GYRSET® SystemBy using the GYRSET® closed bowl coating, three effects are utilized to greatly widen the available processwindow:with GYRSET®ConventionalTurbulence free coating using GYRSET® allows uniformresist thickness even to the corner of substrateswithout GYRSET®ACS300 Gen2 System OverviewSpin-Coating ModuleThe GYRSET® principle enables highly uniform coatingsof 200/300 mm wafers as well as square substrates withminimum resist consumption.
Processes with open androtating closed cover can be accommodated.The spin coating modules have three independent, optionally temperature controlled dispense lines per arm.The solvent media set-ups allow for precision Edge BeadRemoval and Back Side Rinse. The Auto Nozzle Cleanoption allows for individual cleaning of each resist dispense nozzle. Automatic chamber cleaning enables easymaintenance and guarantees higher uptime.0Oven StackDeveloper ModuleThe ACS300 Gen2 HCV stack can be individually config-An assortment of dispense options is available for devel-ured with up to 6 hot or cool plate cassettes or a HMDSoping exposed films.
Binary spray, fan spray or stream /vacuum primer that takes 2 positions in the stack. Thepuddle dispenses are standard configurations. The dis-ACS300 Gen2 can have one HCV stack in a definedpense arms offer programmable sweep movements andmodule position and can also be equipped with a frameare also programmable in height for best spray geome-extension which can have another two HCV stacks.try.The plate cassettes have motorized lift pins with program-For optimal CD uniformity control individual dispense armmable lift height as well as fixed minimum proximity ballssweep patterns can be programmed in each recipe.
Thewhich guarantees for optimum bake results. Evaporatingpoint-of-use temperature control offers excellent uniform-solvent is extracted through a balanced environment ofity for temperature sensitive processes.individually adjustable exhaust and nitrogen purge.Process Flow IntegrationIn each frame one central 6-axis robot serves up to fourprocess modules. For larger configurations further robotscan be added.The industry proven 6-axis robot combines highest speedand accuracy with a long range. With a maximum payload of over 3 kg this robot also allows for handling heavysubstrates like stacked wafers or carrier solutions likeglass, silicon or ceramics.
Non-contact wafer centering isaccomplished by an optical pre-aligner system that usesmachine vision for determining the wafer position. Anymisalignment is corrected by the robot.Input / Output Module (I/O)Media CabinetThe ACS300 Gen2 offers two different I/O options. Up toThe media cabinet is equipped with individual drawers fortwo load port modules can directly be attached to theeasy access to resist and chemicals.
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