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Machine operation is intuitive and easyto learn. The location and status of each wafer in themachine is displayed in real time. Module controllercomponents and software are based on a commondesign for convenient serviceability.SoftwareProcess recipes and flow sequences are generatedwith point and click ease. The sequence cascadingfeature enables continuous substrate flow, even incase of sequence change.

The operator can runmultiple process flows, multiple recipes and multiplesizes simultaneously, for example running a batchof 200 mm wafers through the develop cycle whileprocessing a batch of 150 mm wafers through a coatand bake cycle. Online and offline sequence editingare possible even during operation.8Detailed tool protocols facilitate wafer tracking.A host interface is available which is compliant toSECSII/GEM (Semi E5/E30).■Simple recipe path editing■Modules editable to the path■Simply drag and drop module iconinto path■Own icons for each “module slot”CoatingLithography ClusterThe LithoFab200 is a fully clustered lithography solution consisting of an MA200Compact mask aligner andan ACS200 coat/bake develop module.

The cluster isspecifically used in high volume LED production andfor a variety of MEMS applications. With its productionproven design the LithoFab200 enables exceptionalprocess scalability and fast time-to-market for newdevice designs, while reducing cycle times and excesswafer inventory. If required the LithoFab200 can beoperated in-line as coat/bake/expose and developcluster or separately in stand-alone mode in parallel.Additionally, the cluster is designed to address theunique processes used in compound semiconductorproduction such as retrograde profile generation.

Otherimportant capabilities include solutions for pyroelectricmaterials, such as lithium niobate, using active ionization. The Lithography Cluster is well suited to handlingfragile materials like GaAs or InP by using specializedmaterial handling hardware.MA200Compact Mask AlignerThe MA200 Compact represents the next generationof fab friendly full-field lithography systems. The newflexible robot handler design allows for wafer handlingwith 2 (optional 4) cassettes. The system features acompact footprint of only 2.12m2.

SECSII/GEM functionality is available as an option. The MA200Compactis equipped with top- and bottomside alignmentachieving an alignment accuracy of 앐 1 µm. The newDirectAlign option of the MA200Compact offers anunsurpassed alignment accuracy down to 0.5 µm (3␴),the highest precision available for a mask alignertoday.Exposing /AligningLith o Fab200Transfer position between exposure and coat moduleThe MA200Compact is a very efficient exposure toolfor thick resist. With its high intensity illumination andhigh intensity optics the MA200Compact features acomplete suppression of stray light effects, and a verylarge depth of focus, which yields excellent results evenwith thick resist layers and high topography wafers.Features and benefits■Fully integrated cluster for coating, baking,exposing and developing of substratesfrom 2씵 to 200 mm■Dry wafers in – patterned wafers out■High level of automation for improvedyield because of minimum operator intervention■1X Full-Field proximity mask aligner unitwith excellent exposure results in virtuallyall thick resist materials and 100% flexibility in edge processing■Optimum process control■Unmatched throughput■Minimum cleanroom space required■Configuration and flow flexibility forbalancing and/or running multiple processes for each systemLithography ClusterLithoFab200 cluster9■Process modules areconfigured in a 2, 4,6 or 8 module cellaround a central robot■Cassette access viacentral robot (2 cassette stations) or separate in-line robot■Additional cells canbe added for largerconfigurations■The system can beinterfaced with a maskaligner module toform the LithoFab200.ACS200Plus(4 modules)LithoFab200(8 modules + mask aligner)Example ConfigurationsExample ConfigurationACS200Plus: 4 processmodules + 2 cassette I/O10ACS200Plus: 4 process moduleswith SpraycoaterLithoFab200: 4 process modules+ mask aligner (MA200)ACS200Plus: 6 process moduleswith SpraycoaterLithoFab200: 6 process modules withspray coater + mask aligner (MA200)ACS200Plus: 8 processmodules + 2 cassette I/OLithoFab200: 8 process modules+ mask aligner (MA200)Technical DataSubstrate processingUser interface2000Max.Max.Max.Max.####coat modulesdevelop modulesHP/CP ovensof recipes2씵 to 200 mm round, 2씵 to 6씵 square, rectangularFully automatic, open cassetteOption: SMIF and AGV load/unloadOption: substrate edge handling, fragile substratesFully programmable random access clusterWindows 2000®graphical user interface> 10 (scalable system)> 10 (scalable system)> 30 (scalable system)> 1000 module recipesCoat and Develop ModulesSpin speed control# of dispense lines# of dispense armsOptions1900Develop chemistriesDeveloper dispenseCleaner dispenseLift-off dispense±1 rpm with digital spin motor controller3 standard per arm with optional independenttemperature control up to dispense tipup to 2Programmable exhaustEdge bead removal and back side rinsePre- and dummy dispenseSoftware interlocked chemical flow detectionGYRSET® or open bowl processesSpin motor flange temperature controlModule designs for aqueous and solvent baseddevelopingFan spray, binary and streamMegasonic or high pressureFan spray and high pressure needle jetExposing /Aligning310Substrate sizeSubstrate handlingCoatingClusterOven Stack ModulesHot plateHot plate temperatureTemperature uniformityBake method17101900Cool plateCool plate temperatureTemperature controlCool methodVapor PrimeVapor prime temperaturePriming methodUp to 250°COption: up to 350°C± 0.5°C up to 120°C± 1% > 120°COption: ± 0.25°C up to 120°CFixed and programmable proximityOption: electrostatic charge control for pyroelectricwafers20 to 25°C± 0.2°CFixed and programmable proximityOption: electrostatic charge control for pyroelectricwafersUp to 200°CVapor injection via nitrogen bubbler processVacuumClean Dry AirNitrogenPower1710– 0.9 to – 0.7 bar6 to 8 bar6 to 8 barConfiguration dependentData, design and specification of custom built machines depend on individualprocess conditions and can vary according to equipment configurations.

Notall specifications may be valid simultaneously. Illustrations in this brochure arenot legally binding. SUSS reserves the right to change machine specificationswithout prior notice.Technical DataUtilities11Serving Our CustomersWith more than 8,000 systems installed worldwide, SUSS MicroTec belongs to the leading suppliers of process and equipmentsolutions for microstructuring in the semiconductor industry. Our commitment to superior performance and cost-effective solutions hasmade us a technology leader as well as a reliable partner for R&D and manufacturing.Throughout the world dedicated and highly trained service teams support our customers with routine maintenance, training and fieldupgrades.

Our service record is what we are continuously acknowledged for with customer satisfaction awards – we are there for you!Visit www.suss.com/locations for your nearest SUSS representative or contact us:SUSS MicroTec | Phone: +49 89 32007 0 | info@suss.comwww.suss.com.

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