BR_ACS200Plus_nodate (1063498)
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CoatingExposure /AligningBondingTestingLith o Fab200Production Coat/Develop ClusterACS200PlusLithography ClusterLithoFab200www.suss.comSuperior Spin & SprayCoating ClusterThe SUSS ACS200Plus is a modular coat / developcluster system that enables excellent coating anddeveloping uniformity on round, square and rectangularsubstrates. It combines the features and benefits of thesuccessful SUSS cluster systems ACS200 and Falcon,with a joint installed base of more than 200 systems.IntroductionThe system’s performance and productivity are unsurpassed for a large variety of applications, suchas thin and thick resist coating, topography coating,and processing of photosensitive polymers, suchas polyimide and Cyclotene™ (BCB).
SUSS’ ownpatented GYRSET® coating technology enables fringefree coating with reduced chemical consumption.The SUSS’ Auto-Sizing™ feature offers unparalleledflexibility as it enables the processing of different wafersizes without mechanical changeover. The modulardesign permits unmatched configuration flexibility.Dock & Lock™ process modules allow reconfigurationin the field to accommodate to future lithographyneeds. Its unmatched process and configuration flexibility have made the ACS200Plus the preferred toolfor sophisticated photoresist processing for highvolume MEMS, 3D-integration, optoelectronics andpackaging applications.2The ACS200Plus can be linked directly to a SUSS 1XFull Field proximity mask aligner module to form the fullyintegrated LithoFab200 Cluster.Features and benefits■Scalable cluster architecture with independent, field-upgradeable Dock & Lock™process modules■SUSS Cassette Auto-Sizing™ with zeromechanical changeover between differentwafer sizes■Substrates round from 50 mm to 200 mmand square from 2앨 to 6앨■Parallel flow functionality for optimizedmachine utilization■GYRSET® closed bowl coating technology■Excellent thick resist capabilities■Fringe free coatings of square substrates■Spray Coating option■Precision edge bead removal■Stream and spray dispenses for highlyuniform resist development■SECSII/GEM interface■Optional local cleanroom / SMIF box integration capability■Optional interface to full-field proximitymask aligner (see page 9)CoatingACS200Plus coating modulesACS200Plus Coating TechnologiesExposing /AligningVideo Centering StationThe GYRSET® principleThe GYRSET rotating closed cover coating processenables a unique turbulence-free, solvent rich atmosphere above the substrate during coating, therebysignificantly reducing the effect of ambient temperatureand humidity of the process.
As the material stayswet for an extended period of time, its surface wettingcapability remains high and subsequently the materialrequired to coat a wafer can be substantially reduced.In short: the GYRSET principle enables reduced chemical consumption, wider process windows and betteroverall performance potential. GYRSET technology alsoenables the fringe free coating of square substrates inthe edge regions.automatically recognized in the machine and flowsequences with different substrate sizes can be runconcurrently.Substrate handlingThe ACS200Plus allows for the most flexible adaptionto the various special handling requirements.
Doubleside structured, square or rectangular, ultrathin, fragileand warped substrates can be easily accommodated.In addition SUSS offers specially designed tooling forwafers that require wafer edge handling.Processing multiple wafer sizesTurbulence freecoating usingGYRSET® allowsuniform resistthickness evento the corner ofsubstratesCoating TechnologiesDue to the air flow design in the GYRSET coat bowl,different wafer sizes can be processed without theneed for any mechanical changeover.
Wafer sizes are3The Fine Art of CoatingMEMS, 3D-Integration, Optoelectronics, Advanced PackagingThe SUSS ACS200Plus coating cluster is able to deliver consistently uniform results for a variety of applications such as thin and thick resists, planarization,BCB, polyimide and other dielectrics, as well as forsquares, topography, cavities, or through-holes.High frequency devicesThe Fine Art of CoatingThermal processing of pyroelectric substrate materials, such as lithium niobate and lithium tantalatecan generate extremely high electrostatic voltagesand discharges.
SUSS coaters can be equippedwith a carefully designed set of components toprevent yield loss due to discharges. For high-endSAW filters, very fine structures need to be generated. SUSS process module adaptations enable highlyuniform coating and developing of these structureson pyroelectric substrates.4Thick layer lithographyLithography processes for Advanced Packaging and3D integration usually require processing of thickresists or polyimide. The optimized coat bowl designof the ACS200Plus allows suppression of build-upof cast-off resist. Precision programmable edge beadremoval is employed to avoid edge beads that areoften encountered when coating ultra-thick resists.High Quality Polyimide ProcessingThe ACS200Plus offers superior performance for photosensitive polyimides. These high temperature engineered polymers demonstrate excellent mechanical thermaland electrical properties and are widely used in advanced packaging, microelectronic applications includingstress buffer, passivation layer, chip bonding, redistribution layers and interlayer dielectric.Photo-BCB dielectrics, Cu, BCB, Cu, cross sectionfor planarization of photo BCB.7.8 micron of BCB coating.TOK PMER PLA900 positive acting resist, coated.75 µm JSR THB 151-N, negativeacting resist coated on a 200 mmwafer, ± 3.4% uniformity across wafer.Processes for the fabrication of 3D microstructuresare commonly found in the field of MEMS, compound semiconductor, and advanced packaging.For conformal coatings over topographies greaterthan 30 microns, SUSS has introduced AltaSpray,a revolutionary spray coating technique.
Reliablestructure edge coverage is secured using theSUSS patented topography coat process flow. Formore information on spray coating, please refer tothe SUSS AltaSpray brochure.ASAHI PIMEL, I-8000 polyimide series, 5 micronthickness after cure, no crowning effects.HD4021 self-priming photosensitive polyimide,40 µm thickness, 45° sidewall, 40 µm proximity.Spray coated and exposed with SUSS AltaSprayand MA6 Mask Aligner using AZ4999 resist.
50 µmresist lines across 200 µm deep trench.Spray coated with AZ4999 across KOH etched, 200 µmdeep topography.. 20 µm features resolved at bottom oftrench with SUSS MA6 Mask Aligner using LGO optics.CoatingExposing /AligningFabricating the many different varieties of microelectromechanical systems (MEMS) poses complexprocessing challenges, particularly in the lithographyarea.
A MEMS wafer is prepared having a pluralityof MEMS structure sites thereon and it can consistof different shapes and materials. The ACS200Plusallows for flexible adaption to the various specialhandling requirements. Double side structured, warped and bowed wafers can be easily accommodated.For thin wafer handling special tooling is available.Reduced operator intervention and a minimum number of handling steps reduce the stress that MEMSsubstrates are subjected to during lithography processing.SUSS AltaSpray technology:Best-in-class topography coatingCoating Solutions for MEMSCoating Solutions for MEMS5Spin Coating ModuleFor spin coating, both open bowl and GYRSET ® rotatingclosed cover systems are available. The spin coating modules have brushless spin motors with a speed accuracy ofbetter than 1 rpm.
To prevent thermal influences the motorflange can be temperature controlled. Up to two dispensearms per coat module allow for a large variety of photoresistand solvent dispenses such as prewetting and edge beadremoval. Resist lines can be individually temperature controlled for optimized thickness uniformity control.Coat module with GYRSET®System OverviewSpray coatmoduleSpray Coat ModuleThe AltaSpray coating technology from SUSS successfullymeets the challenge of coating high topography. SUSSAltaSpray is capable of depositing high resolution resist filmson different 3-D microstructures, while being able to deliverconsistent conformal coatings on various structures suchas 90° corners, KOH etched cavities, V-grooves or lenses.Oven stackSystem OverviewOven Stack6Each oven stack can be individually configured with platesfor baking and chilling of wafers as well as for vapor priming.
Telescopic rails permit easy access to the bake platesfor cleaning and maintenance. Proximity bake processesare carried out using either fixed position ceramic balls ormotorized programmable lift pins. For best bake results thehot plates are equipped with individually adjustable exhaustand nitrogen purge. Vapor priming is accomplished usinginjection of HMDS via a nitrogen carrier gas.Chemical Supply CabinetThe chemical supply cabinet is equipped with individualdrawers for easy access to resist and chemicals. Tankscan be filled from a central chemical supply. Automatictank and bottle switching enables continuous operation.The chemical supply is configurable for a large varietyof chemical combinations.2 cassette I/OMultiple developers in configuration with coversExposing /AligningAn assortment of dispense options is employedfor developing exposed films.
Binary spray, fanspray or stream/puddle dispenses are standardconfigurations. Both aqueous and solvent basedchemistries can be accommodated. For wafercleaning, megasonic and high pressure cleaningare possible. Metal Lift-off processes can be performed using heated solvent at high pressure.The dispense arms are programmable in heightfor best spray geometry. For optimal CD uniformity control dispense arm sweep patternsare user definable in each recipe.CoatingDeveloper Module4 cassette I/OInput / Output Module (I/O)The I/O accommodates round wafersfrom 50 mm to 200 mm and squaresubstrates from 2씵 to 6씵 on a side.Customer specific sizes can also beaccommodated.
Different wafer sizescan be processed concurrently without any mechanical change-over dueto the SUSS Autosizing™ feature. Asoftware interlock assures that anyprocess sequence is carried out onlyfor the correctly assigned substratesize. Substrate cassettes are scannedto detect the occupied positions inany loaded cassette. Standard machines come equipped with either twocassette stations or with four cassettestations for high volume productionapplications.Local EnvironmentEasy MaintenanceChemical supply cabinetMaintenance on a process module can be performedwhile the rest of the machine remains in operation.
Maintenance personnel can easily access all service functions.The Dock & Lock™ process modules are field-upgradeablefor increased capability and productivity.System OverviewThe ACS200Plus can be configured with a variety ofenvironmental control options, such as filtration, temperature and humidity control, as well as chemical filtration for amine control.7■Indication of levelfor all chemicals■Visualization and statusof wafers■Icons for each module■Fully programmableuser levels■Instant access to allcurrent analog & digitalmodule parametersSoftwareThe production proven, Windows® based software ofthe ACS200Plus offers the most up-to-date controllertechnology available in the market.It provides a user interface that graphically showsthe current status of the whole machine. For servicepurposes each connected module can be accessedindividually.
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