USP_20010020443 (1063353), страница 5
Текст из файла (страница 5)
The method of claim 29 Wherein rotating the microelectronic substrate occurs Without rotating a collectingvessel positioned beneath the loWer surface of the microelectronic substrate to collect liquid ?oWing from the microelectronic substrate.electronic substrate from a second portion of gasspaced apart from the microelectronic substrate andgenerally stationary relative to the microelectronic substrate.36. The apparatus of claim 35 Wherein the supportincludes a ?ange facing toWard the second surface of themicroelectronic substrate and extending radially outWardlyfrom the rotation axis, the barrier being spaced apart fromthe ?ange to de?ne a gap betWeen the ?ange and the barrierfacing toWard the second surface of the microelectronicsubstrate, the apparatus further comprising a plurality ofnoZZles positioned proximate to the gap to direct a cleaningsolution toWard the second surface of the microelectronicsubstrate.37.
The apparatus of claim 35 Wherein the supportincludes a ?ange facing toWard the second surface of themicroelectronic substrate and extending radially outWardlyfrom the rotation axis, the barrier being spaced apart fromthe ?ange to de?ne a gap betWeen the ?ange and the barrierfacing toWard the second surface of the microelectronicsubstrate, the apparatus further comprising:a plurality of noZZles positioned proximate to the gap andcoupled to a source of cleaning solution to direct thecleaning solution toWard the second surface of themicroelectronic substrate;a temperature controller coupled to the source of cleaningsolution to control a temperature of the cleaning solution; and31. The method of claim 29 Wherein rotating the microelectronic substrate includes spinning the microelectronica collection vessel positioned beneath the microelectronicsubstrate at a rate of betWeen approximately 2,000 tothe microelectronic substrate as the microelectronicapproximately 4,000 revolutions per minute.32.
The method of claim 29 Wherein disposing the liquidincludes directing a stream of liquid through an opening inthe barrier toWard the substrate.33. The method of claim 29 Wherein disposing the liquidon the microelectronic substrate includes dispensing a photoresist material on the microelectronic substrate.34. The method of claim 29 Wherein distributing theliquid to a generally uniform thickness includes forming aliquid layer having a thickness variation in the range of fromabout ten Angstroms to about thirty Angstroms.35.
An apparatus for disposing a ?uid on a ?rst surface ofa microelectronic substrate, the microelectronic substratehaving a second surface facing opposite the ?rst surface, theapparatus comprisinga support having an engaging portion for engaging themicroelectronic substrate, the support being rotatableabout a rotation axis at a ?rst rate, the engaging portionbeing con?gured such that the microelectronic substrate overhangs the engaging portion;a conduit having an opening positioned proximate to thesupport for disposing the ?uid on the ?rst surface of themicroelectronic substrate; anda rotating barrier proximate to the support and rotatable ata second rate approximately equal to the ?rst rate, thebarrier extending over the ?rst surface of the microelectronic substrate to at least partially face toWard the?rst surface of the microelectronic substrate and separate a ?rst portion of gas adjacent the surfaces of themicroelectronic substrate and rotating With the microsubstrate to collect liquid expelled from the surfaces ofsubstrate rotates, the support and the barrier beingrotatable relative to the collection vessel.38.
The apparatus of claim 35 Wherein the barrier iscoupled to the support to rotate With the support, at least aportion of the barrier being generally parallel to the ?rstsurface of the microelectronic substrate and having anopening for the liquid to pass through.39. The apparatus of claim 35 Wherein the barrier isremovably attached to the support and movable relative tothe support betWeen an attached position and a detachedposition.40. The apparatus of claim 35 Wherein the supportincludes a barrier support portion extending outWardlybeyond the engaging portion to support the barrier.41. The apparatus of claim 35, further comprising acollection vessel extending outWardly beyond the engagingportion to collect ?uid dripping from the substrate.42.
The apparatus of claim 35 Wherein the barrier includesa ?rst opening for exhausting gas betWeen the barrier and thesubstrate When the substrate is engaged by the support anda second opening for introducing gas betWeen the barrierand the substrate When the substrate is engaged by thesupport.43. The apparatus of claim 35 Wherein the barrier has agenerally circular cross-sectional shape When intersected bya plane generally parallel to the microelectronic substrate.44.
The apparatus of claim 35, further comprising themicroelectronic substrate Wherein the microelectronic substrate has a generally circular planform shape.45. The apparatus of claim 44 Wherein the microelectronicsubstrate has a diameter greater than approximately eightinches.Sep.
13, 2001US 2001/0020443 A146. The apparatus of claim 44 wherein the microelectronicsubstrate has a diameter of approximately tWelve inches.47. The apparatus of claim 35 Wherein the support isrotatable at up to approximately 4,000 rpm.48. The apparatus of claim 35, further comprising a sourceof rinse liquid in ?uid communication With the secondsurface of the microelectronic substrate for rinsing thesecond surface.49. The apparatus of claim 48, further comprising atemperature controller coupled to the source of rinse ?uid tocontrol a temperature of the rinse ?uid and a rate of heat53. The apparatus of claim 52 Wherein the retaining vesselhas a base, sideWalls extending upWardly from the base, andan upWardly facing opening for collecting ?uid from themicroelectronic substrate.54.
The apparatus of claim 52 Wherein the retaining vesselis positioned beneath the support.55. The apparatus of claim 52 Wherein the retaining vesselincludes at least one port for removing ?uid collected in theretaining vessel.centipoise to tWenty centipoise.56. The apparatus of claim 52 Wherein at least a portionof the barrier is generally parallel to the surface of thesubstrate and has an opening for the liquid to pass through.57. The apparatus of claim 52 Wherein the support51. The apparatus of claim 48, further comprising theliquid, the liquid including a photoresist material.includes a ?ange extending radially outWardly from therotation axis, the barrier being spaced apart from the ?ange52. An apparatus for disposing a ?uid onto a ?rst surfaceof a microelectronic substrate, the microelectronic substrateto de?ne a gap betWeen the ?ange and the barrier facingtoWard the second surface of the microelectronic substrate,the apparatus further comprising a plurality of noZZlespositioned proximate to the gap to direct a cleaning solutiontoWard the second surface of the microelectronic substrate.58.
The apparatus of claim 52 Wherein the barrier isremovably attached to the support and movable relative tothe support betWeen an attached position and a detachedtransfer from the microelectronic substrate.50. The apparatus of claim 48, further comprising theliquid, the liquid having a viscosity in the range of from ?vehaving a second surface opposite the ?rst surface, theapparatus comprising:a support having an engaging portion for engaging themicroelectronic substrate, the support being rotatableabout a rotation axis, the engaging portion being con?gured to engage less than the entire second surface ofthe microelectronic substrate;a conduit having an opening positioned proximate to thesupport for disposing the ?uid on the surface of themicroelectronic substrate;a ?xed retaining vessel positioned proximate to the support to collect ?uid from the microelectronic substrate,the engaging portion of the support being rotatableposition.59.
The apparatus of claim 52, further comprising themicroelectronic substrate Wherein the microelectronic substrate has a generally circular planform shape.60. The apparatus of claim 5 9 Wherein the microelectronicsubstrate has a diameter greater than approximately eighta barrier coupled to the support and rotatable With theinches.61. The apparatus of claim 5 9 Wherein the microelectronicsubstrate has a diameter of approximately tWelve inches.engaging portion relative to the vessel, the barrier beingspaced apart from and proximate to the microelectronic62.
The apparatus of claim 52, further comprising theliquid, the liquid having a viscosity in the range of betWeenrelative to the ?xed vessel; andsubstrate to separate a ?rst portion of gas adjacent themicroelectronic substrate and rotating With the microelectronic substrate from a second portion of gasspaced apart from the microelectronic substrate andgenerally stationary relative to the microelectronic substrate.?ve centipoise and tWenty centipoise.63.
The apparatus of claim 52, further comprising theliquid, the liquid including a photoresist material..
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