USP_8353255_Suss (1063351)
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US008353255B2(12) United States PatentBeyer et al.(54)US 8,353,255 B2(10) Patent N0.:(45) Date of Patent:DEVICE FOR COATINGA SUBSTRATE(75) Inventors: Ralph Beyer, Miihlacker (DE); StefanLutter, Nur‘tingen (DE); Rainer Targus,Vaihingen (DE)6,306,455 B110/20016,576,055 B26/2003Jan. 15, 2013Takamori et al. ............... ..
427/8Shirley ......... ..2001/0003965 A16/2001 Sada et al.2004/00531473/2004A1Ito. . . . . . . . . . . . . . . . . . . . . .2004/0180141 A19/2004 Kobayashi et a1.2008/0176172 A1*7/2008.. 118/52118/63. . . ..430/30427/240Funakoshi et al. .......... .. 430/313FOREIGN PATENT DOCUMENTS(73) Assignee: Siiss MicroTec Lithography GmbH,Garching (DE)DE10 2007 033 226 A11/2009Subject to any disclaimer, the term of thispatent is extended or adjusted under 35Patent Abstracts of Japan; Japanese Patent Publication No.
02149367OTHER PUBLICATIONS(*)Notice:U.S.C. 154(b) by 315 days.(21) Appl.No.: 12/658,077(22) Filed:(74) Attorney, Agent, orFirm * Ohlandt, Greeley, Ruggiero& Perle, LLP; George W. Rauchfuss, Jr.Aug. 5,2010(57)Foreign Application Priority DataFeb. 3, 2009(51)Primary Examiner * YeWebdar TadessePrior Publication DataUS 2010/0192843 A1(30)* cited by examinerFeb.
2, 2010(65)(DE) ....................... .. 10 2009 007 260Int. Cl.B05C 11/02B05C 13/00A, published Jun. 7, 1990.German Patent Of?ce Search Report of May 12, 2009 in Germanpriority Patent Application No. 10 2009 007 260.8.(2006.01)(2006.01)ABSTRACTBy means of the device for coating a substrate (2; 102)according to the present invention, a homogeneous coating ofthe substrate (2; 102) can be achieved. The device comprisesa holding and rotating means for holding and rotating thesubstrate (2; 102) about an axis (A).
A disk (3) is providedbeloW the substrate (2; 102). Said disk (3) is arranged coaxi(52)US. Cl. ......................... .. 118/52; 118/500; 118/612ally With respect to the substrate (2; 102), has at least the same(58)Field of Classi?cation Search .................. .. 118/52,diameter as the substrate (2; 102) and is able to rotate syn118/612, 319, 320, 56, 500, 326; 396/604,396/611, 627; 427/240See application ?le for complete search history.chronously With the substrate (2; 102).
By means of the disk(3), air sWirls at the edge of and beloW the substrate (2; 102)are avoided during coating of the substrate (2; 102). Thus, it ispossible to obtain a homogeneous coating. For being able toReferences Citedload and unload a substrate (2; 102) into and out of the deviceby means of a conventional gripper system (6), the distanceU.S. PATENT DOCUMENTSbetween substrate (2; 102) and disk (3) is increased during(56)5,718,763 A2/1998 Tateyama et al. .............
.. 118/525,762,709 A6/1998 Sugimoto et al.5,803,968 A9/1998loading and unloading.118/52Schwartz et al. ............. .. 118/5212 Claims, 2 Drawing SheetsU S. PatentJan. 15, 2013WSheet 1 of2MW"95g, 1%. hUS 8,353,255 B2US. PatentJan. 15, 2013Sheet 2 of2US 8,353,255 B2US 8,353,255 B212DEVICE FOR COATING A SUBSTRATEmeans of a conventional gripper system. When using a meansfor rotating the disk, the disk can rotate synchronously WithFIELD OF THE INVENTIONthe substrate about the same axis.The distance varying means can be con?gured such that itprojects through a hole in the disk along the common axis ofsubstrate and disk.
The distance betWeen substrate and diskcan be varied in that the distance varying means is elongatedThe present invention relates to a device for coating asubstrate by spinning-off the coating material. It relates inparticular to a device in Which a contamination of the edgesand the rear surfaces of the substrates can be prevented duringthe coating process and in Which a uniform coating isachieved.or con?gured so as to be axially movable relative to the disk.Alternatively, a disk holder can move the disk along thedistance varying means in the axial direction, in order to thusvary the distance betWeen substrate and disk.
The distanceBACKGROUND TO THE INVENTIONvarying means can be con?gured as holding and rotatingmeans.DE 10 2007 033 226 A1 discloses an aerodynamic spinThe holding and rotating means for the substrate can comning process for applying liquid layers, realiZed as a singleprise a centering pin for engagement With an axial bore of thesubstrate.
The centering pin can be provided in the center ofthe support surface on Which the substrate rests. The supportsurface can be formed by the end surface of the distanceWafer apparatus Which comprises at least one air ?oW deviceand at least one holding and moving device. Further technological background is disclosed in US 2001/0003965 A1, DE10 2004 011 850 B4, US. Pat.
No. 6,576,055 B2, US. Pat.No. 6,306,455 B1, US. Pat. No. 5,803,968 A, US. Pat. No.5,762,709 A, US. Pat. No. 5,718,763 A, JP 2004/072120 A,and JP 02149367 A.In normal devices for coating substrates, the substrates arerotated and at the same time the substance by means of Whichthe substrate is to be coated is applied to the substrate. Therotating movement causes the substance, eg a lacquer, tovarying means. A possible alternative holding and rotating20means for the substrate comprises a support surface on a ?rstside of the substrate and a counter surface on a second side ofdistribute on the substrate. When spinning the substance off,the substrate.
The support surface can be formed by the endsurface of the distance varying means. By means of thecounter-surface, Which has a smaller diameter than the substrate to be coated, a pressure is applied to the second surfaceof the substrate, so that the substrate is clamped betWeencontact surface and counter surface. The force acting on theair sWirls are caused at the edge of the substrate or at the loWerside of the substrate. These air sWirls cause contamination ofWith respect to the substrate.the edges and/or rear sides. A homogeneity of the layer thick25substrate from both sides is thus applied essentially coaxially30ness of the substance of less than 20% on the substrate isDuring coating of the substrate, the distance betWeen subhardly possible.strate and disk is relatively small in order to prevent air sWirlsat the edge of the substrate and at the loWer side of theIn vieW of the above-mentioned problems of the prior art, itis the object of the present invention to provide a device forerably 0.2 mm.coating substrates in Which the homogeneity of the layersubstrate, and is preferably 0.1 to 0.3 mm, particularly pref35BRIEF DESCRIPTION OF THE DRAWINGSthickness of the substance on the substrate can be improved.Moreover, an automated loading and unloading of the subIn the folloWing, the invention Will be explained in moredetail With reference to the schematic illustrations in thestrates into and out of the device by means of conventionalgripper systems, such as ?nger, fork or edge grippers, isprovided.
These objects of the invention are achieved by the40features of the claims.draWings in WhichFIG. 1a shoWs a top vieW of a substrate coating deviceaccording to the invention;SUMMARY OF THE INVENTIONFIG. 1b is a sectional vieW along the dashed line of FIG. 1a,With disk and substrate being relatively close together;In achieving these objects, the invention starts out from thefolloWing basic idea: BeloW the substrate to be coated, thereis provided a disk Which is arranged coaxially With respect to45the substrate and has at least the same diameter as the substrate. When adjusting a relatively small distance betWeensubstrate and disk, air sWirls can be avoided during the coatFIG.
10 is a sectional vieW similar to that of FIG. 1b at atime point at Which a gripper system lifts the substrate fromthe device or places it onto the device;FIG. 2a is a schematic illustration of an alternative Way ofholding a substrate according to the present invention, With50ing process.
This increases the homogeneity of the coating.disk and substrate being relatively close together;FIG. 2b is a schematic illustration similar to that of FIG. 211at a time point at Which a gripper system lifts the substratefrom the device or places it onto the device.For being able to load and unload substrates into and out of thesubstrate coating device by means of conventional grippersystems, the distance betWeen substrate and disk is increasedduring loading and unloading.55The device for coating a substrate comprises a holding androtating means for holding and rotating the substrate about anAccording to FIG.
1a, the device comprises a centering pinaxis extending essentially perpendicularly With respect to thesubstrate plane. BeloW the substrate there is provided a diskWhich is arranged coaxially With respect to the substrate and1 and a disk 3 With the substrate 2 to be coated. Centering pin1, substrate 2 and disk 3 are arranged coaxially With respect to60has at least the same diameter as the substrate.
When thedistance betWeen substrate and disk is small, air sWirls can beavoided at the edge and the loWer side of the substrate. Thisleads to an improved homogeneity of the coating on thesubstrate. The distance betWeen the substrate and the disk canbe varied by means of a distance varying means. This alloWsto load and unload substrates into and out of the device byDETAILED DESCRIPTION OF THE INVENTIONthe axis A. The substrate 2 to be coated can be a Wafer, a CD,DVD or the like having a hole in the center.
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