Datasheet_ACS200_Gen3 (1063658)
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ACS200 Gen3Automated coater / developer PlatformACS200 Gen3 SolutionsProcessFlexibility+ Universal platform for substrates from 2 ’’ up to 200 mm in diameter+ Spin-, spray- and GYRSET® closed cover coatingfor covering flat to high topographies+ Dispense systems for resist thicknessesranging from 1 µm to over 500 µm+ Developing of positive and negative resists with multiplenozzle options for puddle and spray developingProductionCapability+ Fully automated platform+ Configuration with up to 4 wet process modules with 19 platesallow for high volume manufacturing+ Direct connection to exposure tool possibleLow Cost ofOwnership+ High throughput coating and / or developing by+ maximized number of process modules+ dual end effector robot system+ auto load cassette station+ High EBR accuracy to increase yield+ Small footprint with high module to space ratioChanging the Game Combining the best of Gamma and ACS200Plus platformsThe SUSS ACS200 Gen3 platform is the perfect mix of innovationand production proven components of our well establishedGamma and ACS200Plus tools.
With the capability of up to 4wet process modules and a maximum of 19 plates it perfectlysuites the needs of high volume manufacturing (HVM).The unmatched configuration flexibility of modules and technologies covers not only the requirements of the AdvancedPackaging, MEMS and LED market it also bridges the gapbetween R&D and HVM.flows. It simplifies operation with inconvenient or unusual materialsdue to easy cleaning of the bowl and reduced maintenance time.The possibility to separate the solvent and resist lines on 2 differentdispense arms per coater module, the ACS200 Gen3 followsconsequently the path on providing excellent yield.The versatile base frame provides multiple configuration possibilities,e.g.:+ up to 4 wet process modules(either coater and /or developer) with up to 19 plates or+ 2 wet process modules and 2 spray coater moduleswith up to 13 platesWith the possibility of stacking up to 3 plates over each wet processmodule and up to 7 plates in the 5th module, the ACS200 Gen3allows the maximum module count in its class.The direct connection to a SUSS exposure system increases yieldas no operator interaction is necessary for a complete lithographyprocess flow.For developing applications, either an aqueous or solvent developermodule can be configured.
A high variety of different nozzle typesare available to match with any process requirement.Optional filter fan units and temperature / humidity control of thetool results in process stability, reproducibility and finally in a highyield.Different I/O systems match with any need. The 2x I/O serves R&Drequirements, whereas the new designed auto load cassette stationenables a continuous operation without stopping the system forcassette exchange.The novel coater bowl offers state of the art open bowl coatingand the patented GYRSET® closed cover coating technology.
Thebowl design offers the possibility to use disposable process bowlsfor operation without compromising in flow dynamics or exhaustACS200 Gen3 with dual robot handling systemwww.suss.comAutomated coater / developer Platformtechnical dataGeneralAdditional module optionsNumber of Modulesmax. 4 modules + 1 additional plate stack(max. 7 plates)Available Modules- spin coater + 3 optional plates above- spray coater- developer + 3 optional plates above- plate stack (max. 7 plates)2 ” up to 200 mm round, 2 ” to 150 mm squaresubstrates2 consecutive wafer sizes can be handled at thesame timeWafer Load Port2 x I/O, 4 x I/O, auto load cassette station, SMIFSubstrate HandlingSEMI wafer standardoptional: edge handling, bow / warped wafer handlingRobot System3 axis, single or dual arm robotCenteringmechanical centeringoptical centering (also for glass substrates)Optionsflat alignmentwafer ID readerStack ModulesHot PlateHot Plate Temperatureup to 250 °CTemperature Uniformity± 0.5 °C up to 120 °C± 1 % > 120 °CBake Methodfixed and programmable proximityoptions: electrostatic charge control for pyroelectricwafers; top side heatingCool PlateUser InterfaceUser InterfaceWindows XP operating system with SUSS MMCCool Plate Temperature15 to 30 °CDispatchingcyclic mode, with hot-cold handling, swap-allDecision on the Fly (DoF) modeTemperature Control± 0.2 °CCool Methodfixed and programmable proximityoption: electrostatic charge control for pyroelectricwaferRemote Accesshost interfaceModule configured for Spin CoatingVapor PrimeCoater Typesspin coater, Gyrset® closed cover coater# of Dispense Armsup to 2# of Dispense Lines4 standard ( max.
3 with optional independenttemperature control up to dispense tip)Solvent NozzlesEBR, back side rinse, solvent pre dispenseOptionsCleaning Optionsnozzle, bowl cleaningGyrset® cover cleaningEnvironmental Treatmentlocal cleanroomhumidity and temperature controlled environmentFlow Metersdigital as standardSafetyfire suppression systemVapor Prime Temperatureup to 250 °CPriming Methodvapor injection via nitrogen bubbler processGeneral options and utilitiesModule configured for spray CoatingFootprint# of Resist Lines2 separate resist spray nozzlesFootprintSolvent NozzlesEBR, back side rinse, solvent dispenseutilitiesNitrogen Flowrecipe step programmablePowerconfiguration dependentCleaning Optionintegrated nozzle cleaningExhaustconfiguration dependentVacuummin.
- 0.8 bar, +/- 5 %positive / negative developerN28 bar, +/- 10 %# of Dispense Armsup to 2Compressed Air8 bar, +/- 10 %# of Dispense Lines4 standard ( max. 3 with optional independenttemperature control up to dispense tip)Water3 bar, +/- 10 %Module configured for DevelopingDeveloper TypesNozzles Typespositive developer: puddle, fan spraynegative developer: puddle, fan spray, high pressureFlow Metersdigital as standard1850 x 1500 mmData, design and specification depend on individual process conditions and can vary according toequipment configurations.
Not all specifications may be valid simultaneously. Illustrations, photosand specifications in this brochure are not legally binding. SUSS MicroTec reserves the right to changemachine specifications without prior notice.Visit www.suss.com/locations for your nearest SUSS representativeor contact us:SÜSS MicroTec AGPhone: +49 89 32007-0E-Mail: info@suss.comACS200 Gen3: Open bowl spin coater modulewww.suss.comACS200 Gen3 · 07/2012 · DS_ ACS200Gen3_2012 · V1Wafer SizeCENTERING.
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