EVG120_Flyer_-_V01-13 (1063646)

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Product NewsEVG®120Resist Processing SystemThe EVG120 resist processing system is designed for enabling a variety of coatingapplications. The extensive range of specialized features is accordingly matched toconsistently perform uniform process results for both thin and thick resist coatings,advanced packaging, planarization, underfilling and lining with dielectric polymers (e.g.BCB, polyimide), on SEMI standard wafers as well as on irregular shaped substrates, onflat and substrates and severe topographies, such as V-grooves, mesas, etch cavities andthrough-holes.The EVG120 resist processing system provides a universal solution for reliable and highquality spin coat, spray coat and develop applications at throughput rates optimized forusage in volume production.EVG®120 fully automated resist processing system for up to 200mm substrates:•••••••••••••Ultra-compact design for highest productivity at a minimal footprintVersatile combination of multifunctional modules for spin and spray coating, developing, bake and chillPumps and dispense systems for different resist volumes and viscositiesVarious dispense modes available (center, area and edge)Pre-wet function facilitates reduced resist consumptionSpin chamber with encapsulated solvent atmosphere ensures uniform high viscosity resist coatingHighest coating uniformity introducing CoverSpinTM technologyProprietary Omni Spray® ultrasonic atomization technology for conformal coating of extreme topographiesFully integrated solution for combining spin coating with OmniSpray® coating in one process moduleMegasonic technology for cleaning, sono-chemical processing and developing improves process efficiencySophisticated and field-proven robot handling with dual end-effector capability ensures continuous high throughputEVG Framework based smart process scheduling capabilityExcellent process development support & serviceEVG’s proprietary OmniSpray® technology offers enhanced coating performance for processing of severe topographies.Ultrasonic enhanced and to overcome inherent problems of spin deposition techniques that are generated by challenges suchas reflow in cavities and surface tension effects at edges, EVG’s proprietary OmniSpray® technology is introduced.

The capabilityof EVG’s advanced spray coating technique presents the solution for coating photoresist films with unmatched uniformity oncommonly found 3-D microstructures such as steep sidewalls and sharp topography edges, deep trenches with aspect ratios ofup to 1:7, 90° corners, KOH etched cavities, V-grooves or optical lenses.OmniSpray® Technology provides superior features for coating challenges:••••••••••Adjustable rheological properties optimize resist adhesion and flow behavior at the surfaceWide process window for unmatched flexibility in advanced coating applicationsPressureless ultrasonic atomization nozzles for spray generatingSoft, low-velocity fine mist spray with very low impact velocityExtremely precise volume controlConstant fluid droplet size delivers accurate coatingsLayer thickness range from 100 nm to 100 μmDispense rate programmable independent from other parametersDispense rate controlled for reliability of wafer-to-wafer uniformityNitrogen pressure for spray cone shaping programmableEVG's proprietary OmniSpray®resist atomisation nozzleEVG®120 resist processing system with OmniSpray® technologyThe major advantage for customers offered by the EVG120 resist processing system is the opportunity to choose from variouscombinations of features, such as multiple spray beam shapes and various areal dispenses techniques.

Depending on theintended application, be it deposition of photoresists for microlithographic processing of semiconductor wafers, passivation oftopographic features with polymeric dielectric materials, functionalization of bio-interactive structures with high topography oreven highly resistant inorganic coatings for large glass panels, we at EVG can provide you with the ideal equipment.EVG®120 Resist Processing Systems with OmniSpray® Technology offering advantages for applications in:••••Solar cells and flat panelsThin-film applications for organic materialsOLEDs and displaysInkjet printer headsSEM Photograph of aSpray Coated Cavity••••Read-and-write headsAcceleration and pressure sensors and waveguidesNovel interconnect structuresAir bridgesHigh-Q-3D solenoid industors for RF ICs.Courtesy of SIMIT.Patterned, spray coated resist layer inanisotropically etched cavity.Courtesy of TU-Delft DIMES.Printed on paper from sustainable sources.

Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to changedata, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names are registered trademarks and/or the property of EV Group or their respective owners. V01/13Proprietary OmniSpray® Technology.

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