BR_AltaSpray_coating_nodate_lores (1063644)
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LithographyBondingWet ProcessingTestingSUSST O P O G R A P H YC O A T E RCOATING TECHNOLOGY3D-Lithography for AdvancedResist Applicationswww.suss.comThe Challenge: When using spin coating, resist filmtends to fill cavities and tear at the topography edgesThe Goal: Achieve a continuous resist film on substrates with severe topography Source: CiS ErfurtCoating over SevereTopography for Today’sTechnology NeedsProcesses for the fabrication of 3-D microstructuresare commonly found in the field of microelectromechanical systems (MEMS), optical microelectromechanical systems (MOEMS), compound semiconductor, and advanced packaging.
They are thereforeexerting substantial influence across the semiconductor industry. Applications for pressure sensors,weight sensors, micro mirrors, and multiple otherdevices are moving into the third dimension, havingtopography steps with several microns up to 600 µmand more.Coating over Severe TopographyFor coating of such extreme topographies conventional spin coating demonstrates inherent problemsthat are generated by gravity, flow and surface tension effects, which make it impossible to reliablycover steep sidewalls and sharp topography edges.2Bumps for wafer level packagingPiezo motor for MEMS applicationsSource: IMT NeuchatelThe AltaSpray coating technology from SUSS successfully overcomes the limitations of topographycoating.
SUSS AltaSpray is capable of depositinghigh resolution resist films on different 3-D microstructures, while being able to deliver consistentconformal coatings on various structures such as90° corners, KOH etched cavities, V-grooves orlenses.Lenses for MOEMSLithographySpray Coating at its BestThe SUSS’ patent pending AltaSpray approachdelivers consistent conformal coatings overvarious structures having a sidewall slope from0 to 90° and even more.Test structure with a great diversity in the structureorientation and a topography variation of 200 µm.Achieved with 3 µm TOK-PMER-P GH 300M positiveresist.MEMS sensor with a topography variation of 200 µm.Achieved with AZ9260 from AZ Electronic Materials.Source: CIS, ErfurtMEMS sensor with a negative slope on a KOHetched Silicon wafer.
Achieved with AZ9260 fromAZ Electronic Materials.Source: CIS, ErfurtConformal coat of a KOH etched sidewall with topography variation of 200 µm. Achieved with AZ4999from AZ Electronic Materials.Source: CIS, ErfurtSpray Coating at its BestSpray Coating results achieved with SUSS AltaSpray:3About the AltaSpray Coating ProcessSeveral key factors contribute to the unsurpassedcoating results when using SUSS AltaSpray CoatingTechnology:ables easy process adaptation to different substratesizes and shapes.First, by using an optimized dispense nozzle design,excellent control over the spray pattern is achieved.Third, a robust overall setup assures that resist iscoated repeatedly in the desired thickness and distribution.Second, covering the substrate in an x-y spraypattern optimizes the achievable uniformity. Thespray pattern increases process flexibility and en-Fourth, an optimized overall processing sequenceincluding the softbake of the resist assures the finalconformal coat structure.About the AltaSpray Coating ProcessTo create high performance uniform coatingsacross severe topography you need:4ResistDispense NozzleX-Y TableHeated ChuckSpray coating resist ordiluted standard resist(examples shown onpage 5)Binary nozzle optimizedfor uniform resist distributionX-Y table for precisenozzle control and uniform resist coatingHeated chuck for immediate resist drying upondepositionThe ResultUniform coat over severetopography with unsurpassededge coverageLithographyAltaSpray: Challenges & SolutionsThe following pictures show the edge coverage of different resists:AZ 4999 over 90° edge on SiwaferBCB 3022-46 on oxide coveredKOH etched structureAZ 9260Coating a sharp 90° edge is verychallenging – even for spray coating.
The resist tends to flow downthe steep side and breaks the resist film at the edge. The abovemicroscope image demonstratesexcellent coverage of a 90° step.Even BCB 3022-46, a material designed for planarization, can besprayed. It was possible to fullycover the above structure with a54,7° angle. The top of the waferwas still covered by oxide whilethe surface of the slope was Si.In some MEMS applications it isnecessary to pass metal linesthrough V-grooves. Therefore aconformal coating is important.The above microscope imageshows the coverage of a V-groovein an overview and in a cutout.Shipley 1818 on GlassShipley 1818 on KOH etched SiO2Thin resist layer on non-planar surface profiles for MEMS and MOEMSapplications. Conformal depositionof resist (large image) as well as theexcellent overall coating quality fornon-planar profiles in glass (inset).The edge of a KOH-etched substrate shows the same tendency oftearing apart the resist film as the90° step, although it is not assteep.
The material flows down theside wall, where it tends to fill upthe corner and forms a meniscus.Those areas which accumulatephotosensitive material are difficultto expose and to etch. The thickness variation in the microscopeimage above is so small, that theexposure of the resist causes noproblems.AZ ElectronicMaterialsAZ 1500, AZ 4000,AZ 9000, AZ 520DRohm and HaasShipley 1818,1813, SJR 5740TOKPMER-P, TELR-NDow ChemicalBCB 3000 / 4000AsahiCytop CTL 107 MDow CorningSiliconeALLRESISTe-beam PMMAArch ChemicalsDurimide 7020SUSS AltaSpray is capable of handlingalmost every type of resist. Please donot hesitate to contact your local salescontact for more details.AltaSpray: Challenges & SolutionsExamples for resists that havebeen employed with AltaSpray5SUSS AltaSpray Equipment SolutionsLaboratory & pilot productionequipmentThe Delta AltaSpray line of semiautomatic processequipment serves the laboratory and pilot production needs.
It accommodates wafers and substrates up to 8씵 (6씵҂6씵).The Delta and Gamma AltaSpray equipmentsolutions are available with a wide processwindow not possible from alternatives. SUSSAltaSpray Coaters use a novel resist depositionmethod that enables conformal coats acrossflat and steeply sloped surfaces.Features and benefits■Enabling technology for patterning acrosssevere topography■Reliable top edge coverage while avoidingresist accumulation in trenches■Proprietary spray design for optimal reproducibility and cleanliness■Parallel processing of spray and spin coatedwafers■Substrate sizes up to 200 mm round and6앨쎹6앨 squares■Process flexibility to handle a large varietyof photo resists and a large variety of topography step heights and print patterns■2 nozzle option with separated resist linesto avoid cross contamination■Automated cleaning functions of nozzle,edge bead and chuckSUSS AltaSprayVolume production equipment6The Gamma AltaSpray coating platform fulfills allcommon volume production requirements.
Thefully automated cluster delivers reliable, uniformcoatings for wafers up to 200 mm and offers highreproducibility. Gamma AltaSpray can be equippedwith modules for spray and spin coating, developing, hard bake or cooling, and with sender/receivercassette plates.Technical DataGeneral FeaturesSubstrate sizesSubstrate handlingUser interfaceup to 200 mm round and 6씵҂6씵 square substrateswafer piece processing possible for stand-alone machinelift pins in process chuckWindows 2000® graphical user interface (GUI)Module FeaturesSpin speed controlDispense linesDispense assemblyx and y movement control±1 rpm with digital spin motor controllerup to four dispense lines (spray coat, spin coat, solvent)SUSS nozzle with x and y movement capability± 0.1 mmUtilitiesVacuumClean Dry AirNitrogenExhaustPower–0.8 to – 0.6 bar6 to 8 bar5 to 7 barsolvent exhaust requiredconfiguration dependentData, design and specification of custom built machines depend on individual process conditions and can varyaccording to equipment configurations.
Not all specifications may be valid simultaneously. Illustrations in thisbrochure are not legally binding. SUSS reserves the right to change machine specifications without prior notice.Spray Coater1830DeveloperI/OTemperatureModuleFootprint of SUSS Gamma Altaspray Coating Clusterconfigured for two spray coaters, one developer and one temperature module.Technical Data1400Spray Coater7LithographyHigh Topography Exposure withSUSS Mask AlignersThe solution for exposure over high topography:Enabling highly reliable interconnects with a trenchdepth up to 400 µm can be achieved on a SUSSMask Aligner with Large Exposure Gap Optics.Laboratory & pilot productionequipmentManual SUSS Mask Aligners are regarded as thebenchmark for proximity exposure in semiconductor submicron printing and 3D micro system production. The innovative systems accommodatewafers up to 6씵/8씵 and meet customers needs forprecision, reliability and low cost of ownership.Reliable and cost effective coating and 3D exposureover extreme topographies can be achieved usingSUSS Spray Coating technology coupled with a SUSSfull-field Mask Aligner.
In combination, these systemsyield unsurpassed patterning on top, bottom and inthe slope of structures with up to several hundredsof microns of topography.Exposure tools with projection optics have severelimitations to expose high topography because oftheir limited depth of focus.Volume production equipmentFeatures and benefitsSUSS production Mask Aligners have becomesynonymous with superior quality, accuracy andhigh resolution mask aligning equipment.
Thefully automated aligners accommodate wafersup to 300 mm and are the industry’s leadingexposure tool for volume production of flip chipbumping, wafer level packaging and MEMS.■Accurate and precise gap setting for higheryield■High quality exposure optics:Diffraction reducing lenses provide highresolution and optimum edge quality withthick resists■High resolution and alignment accuracy(down to 0.5 µm)■High throughput■Bottomside alignment optionFor more information on these systems pleaserefer to our mask aligner sales bulletins.High Topography ExposureCompared to these systems SUSS Mask Aligners are1X full-field exposure systems for proximity printingthat come equipped with large exposure gap optics.SUSS Mask Aligners have by design a very largedepth of field which yields excellent results even overtopography variations of several hundred microns.8Gamma Altaspry ImageLithographySUSS Altaspray Coating Cluster9Serving Our CustomersWith more than 8,000 systems installed worldwide, SUSS MicroTec belongs to the leading suppliers of process and equipmentsolutions for microstructuring in the semiconductor industry.
Our commitment to superior performance and cost-effective solutions hasmade us a technology leader as well as a reliable partner for R&D and manufacturing.Throughout the world dedicated and highly trained service teams support our customers with routine maintenance, training and fieldupgrades. Our service record is what we are continuously acknowledged for with customer satisfaction awards – we are there for you!Visit www.suss.com/locations for your nearest SUSS representative or contact us:SUSS MicroTec | Phone: +49 89 32007 0 | info@suss.comwww.suss.com.
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