DS_RCD8_2012_V1 (1063516)

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RCD8resist coat and develop PlatformRCD8 SolutionsFeatures andBenefits+ Optional coating and spray/puddle developing in the same toolreduces footprint and capital investment+ Maximized application variety for lowest cost of ownership+ Ergonomic placement of all relevant elements for ease of use+ Easy transfer of processes from the RCD8 platform to aSUSS production tool due to compatible design+ All options are field upgradeableOptions+ Up to three additional modules can be controlled by oneinterface (coater, developer, hotplate, coolplate)+ Open bowl and/or GYRSET® coater+ Puddle and/or spray developer+ Lift pins (also for edge handling)+ Dispense arm (max.

4 dispense lines + 1 syringe system)+ Dispense options from <1 cps to 55 000 cps+ Cleaning functions (nozzle, bowl, cotton candy for GYRSET®,edge of wafer, back side of wafer)The versatile All-Rounder - reliability from SUSS MicroTecThe SUSS RCD8 system is the first tool that offers the option toconvert from a spin coater with the patented GYRSET® closedcover coating technology to a spray developer within a fewminutes.The RCD8 coat and develop platform can be custom tailoredanywhere from e.g. a basic manual spin coater to a semi automatedGYRSET® enhanced coater and puddle & spray developer tool,serving for daily R&D work up to small scale production.Whenever changes are required over time, this versatile tool can befield upgraded with various options to perfectly match your futureneeds.softwareThe standard software installed on the RCD8 platform is productionproven and already installed on hundreds of SUSS systems worldwide.

The control software is based on Windows XP and is sharedwith all other automated SUSS coating platforms allowing a flawlessswitch of systems. The touchscreen GUI (Graphical User Interface)monitors performance and status of the entire machine and tanks.With the intuitive software the operation of the tool is easy to acquire.The generation of process recipes is simplified by point-and-clickease.With its large variety of available chucks and configurations,literally all kind of substrate materials and shapes can be coatedand developed on the RCD8.

The platform can be equipped withvarious well proven dispense line and pump configurations forhandling resists with viscosities from <1 cps up to 55 000 cps.unique gyrset®As an additional option the patented GYRSET® rotating closedcover coating technology can be integrated into the RCD8 spincoating module. For various photoresists and applications, theGYRSET® technology enables a wider process window andreduces material consumption significantly. Furthermore, squaresubstrates and pieces can be coated all the way to the cornerswith a homogenous resist thickness.GYRSET® coaterwww.suss.com125015921720Resist coat and develop Platformtechnical dataGeneralSubstrate SizeRCD8 T2Standalone coater and hotplateRCD8 T2STANDALONECOATER AND HOTPLATEER OPENED2" to 8" round, 2" to 6" squareSubstrate Handlingmanual, optional: lift pinsUser InterfaceSUSS MMC Tool Control on Windows 7, industrialPC with touch screen controlMax.

# of RecipesunlimitedMax. # of Process Steps50Utilities400 V, 16 A, 50 Hz, vacuum not needed, producedinternally by N2 or CDAModule: Open Bowl coaterSpin Speed Max10 000 rpm * ± 1 rpm (with safety hood),12 000 rpm upon special requestSpin Acceleration1 – 7 000 rpm/s*Module: Gyrset® CoaterSpin Speed Max3 000 rpm * ± 1 rpm with GYRSET®Spin Acceleration1 – 3 000 rpm/s *Module: Puddle DeveloperMAX 44015921482MAX 440OPENEDWasteindividual drain connectionBowl MaterialpolyethyleneNozzlesoptional dispense arm with 3 lines(+ 3 lines on separate holder)Module: Spray DeveloperWasteindividual drain connectionBowl MaterialpolyethyleneNozzlesup to 3 in center + up to 2 on side(option: DI rinse, nitrogen purge)Module: Hotplate (HP8)RCD8 T3Standalone coater, hotplateand spray developerRCD8 T3STANDALONEGYRSET COATER,HOTPLATE UNDDEVELOPERvia MMC Tool Control of RCD8 or optional separatecontrollerTemp.

Range60 - 250 °C (± 0.5 °C < 120 °C; ± 1 % ≥ 120 °C)Optionsproximity bake, nitrogen purgeModule: coolplate (CP8)Controllervia MMC Tool Control of RCD8 or optional separatecontrollerMax. Temp.20 - 25 °C; ± 1 °C* substrate and chuck dependentData, design and specification depend on individual process conditions and can vary according toequipment configurations. Not all specifications may be valid simultaneously. Illustrations, photosand specifications in this brochure are not legally binding.

SUSS MicroTec reserves the right to changemachine specifications without prior notice.Visit www.suss.com/locations for your nearest SUSS representativeor contact us:RCD8 · 06/2013 · DS_RCD8_2013 · V3RCD8 BMBench mounted versionGYRSET® coaterMOUNT VERSIONATERControllerSÜSS MicroTec AGPhone: +49 89 32007-0E-Mail: info@suss.comRCD8 TStandalone developerwww.suss.com.

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