BR_Delta80_nodate_lores (1063507)
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80www.suss.comTestingSPIN COATERSGYRSET ®BondingExposing /AligningCoating80GYRSET®Universal 8 Coating System /Advanced Spin CoatingThe Delta 80RC manual Spin Coater from SUSSMicroTec is based on the well known SUSS patented GYRSET ® closed cover coating technology. Itcombines state of the art technology with innovativeexcellence.IntroductionThe Delta 80RC can process delicate wafer fragments,wafers up to 8 ( 200 mm) or substrates up to66 (150150 mm).2The unique design of the Delta 80RC process chamberprovides a better uniformity than conventional openbowl spin coaters.
At the same time it can significantlyreduce resist consumption up to 60% for resists likeBCB compared to conventional spin coating systems.The Delta 80RC with GYRSET® technology is also theideal tool for coatings over topographies in the rangeof up to 20 µm. Better uniformity and less resist consumption make the SUSS Delta 80RC Spin Coater theideal tool regarding cost of ownership.The SUSS Delta 80RC Spin Coater is simple tooperate with fully programmable process parameters.
The system is available as a bench mountedmodule or for stand alone operation integrated intoan attractive stainless steel cabinet. A variety ofoptions are available.Benefits■Uniform coatings with the SUSS patentedGYRSET® technology leads to reducesresist consumption and less edge build-up.This is a guarantee for a very high qualityprocess and repeatability, especially onsquare or rectangular substrates■Multi size configuration with automaticGYRSET® cover size detection and spinspeed limitation set up provide the flexibility to meet all major application typesLithographyPhotoplastic gear, 450 µm high SU-8resistCourtesy: SFIT (EPFL) and IBM (CH)Photoresist pattern of 57 µm thicknessNiFe rotor element, 85 µm high, singleshot coatingThe Patented SolutionThe SUSS80FeaturesMultiple substrate types and sizes with differentmedia for various applications, e.g.쮿 Substrates:– Si, glass and III / V wafers and substrates– Square or rectangular substrates– Optical lenses– X-ray- and photomasks– Compact discs (ROM, audio, video)– Solar cells쮿 Media:– Polyimide / SOG / adhesive promoters– Positive / negative photoresist쮿 Applications:– MEMS technology– Packaging applications– Compound semiconductor applications– Flat panel displays■GYRSET® quick exchange system, allowsfor easy change over between wafer sizes■The process bowl made of polypropyleneis easily removed for cleaning the processchamber■Wafer size up to 8 ( 200 mm) and substrates up to 66 (150150 mm)■Spin speed from 1 up to 7.000 rpm(depends on GYRSET® size or Open Bowloption)■Fully programmable process parameterswith easy to use keyboard and clear textdisplay■Storage of 20 recipes with up to 30 stepsat each recipe or unlimited numbers of recipes storable with laptop option■For the programmable dispense arm different resist pumps, syringe systems andmedia nozzles for accurate and precisedispense are available■Modular design, the ability to mount themodules into a wet bench or a stand alonestainless steel cabinet■Chuck indexing for positioning the chuckaccurately at the same position for easyload / unloadPatented SolutionIs Capable Of Processing:3GYRSET® offers a wider range of resistthickness within a defined range of spin speedGYRSET® system designThe GYRSET® SystemThe patented SUSS GYRSET® system is based ona simple but revolutionary concept.
Compared to aconventional spin coating system it offers multipleunique advantages. The GYRSET® system providesbetter uniformity and up to 60% resist consumptionsavings (depending on resist).The GYRSET® system with indexed bell-shaped coverexcludes air turbulence inside the process chamber.This technique yields a uniform, consistent coatingthickness without the usual spinning defects (no rebounding, no splashback, no striations, no comets,no corner effects).Because of the solvent-saturated atmosphere inside theprocess chamber, the resist drying effect is slowed down.Consequently, better uniformity and process control forthick as well as for thin resist layers are produced.A Wise InvestmentThe GYRSET SystemSUSS480GYRSET®쮿 Reliable, consistent and uniform material application at lower spin speeds쮿 Excellent cost of ownership based on low resistconsumption and reduced waste disposal expenses쮿 Highly reproducible thick resist applications쮿 Coverage even over severe topography쮿 A wide range of resist thicknesses requires fewerresist types쮿 Service and Warranty backed by SUSS with multiple world-wide locationsConventionalCoating SystemGYRSET® SystemUp to 60% less resist consumption with GYRSET®.With the same quantity of resist the whole substrateis covered.LithographySimple And FlexibleMulti Size GYRSET®8 Quick Exchange GYRSET®Multi Profile GYRSETSFixed And Quick ExchangeSelect the GYRSET® height according to the thickness of your substrate.
Use the table below to helpyou choose the correct size.Choose between a fixed or quick exchange GYRSET®plate. Easily removable for cleaning, the quick exchange GYRSET® plate is simply locked by magnetto the hub.5000 rpmDelta 80 GYRSET 34000 rpm3000 rpmDelta 80 GYRSET 5Delta 80 GYRSET 8Interchangeable GYRSET® Systems for 2 up to 8 partsThe GYRSET SystemThe Delta 80 can be equipped with three differentGYRSET® sizes: 3, 5 and 8 to cover various substrate sizes (from 2 to 8).
The configuration is automatically detected and the maximum speed set accordingly. With a change over time of less than5 minutes, the SUSS Delta 80 GYRSET® is the mostflexible and upgradeable coater on the market.5Upper Enclosure Option쮿 Highest Spin Speeds쮿 Maximum Safety according to SEMI Standard S2The Delta80 offers a great process flexibility fromopen bowl to rotating closed cover spin coating.It can be optionally equipped with an upper enclosurefor open bowl coating enabling spin speeds comparable to closed bowl applications.The Delta80 ensures maximum operator safety according to SEMI safety and ergonomic standard S2.STANDARD(Fixed or Quick Exchange)Upper Enclosure OptionGYRSET® Coverclosed6HIGH(Fixed or Quick Exchange)Open BowlGYRSET® CoverOption withopen withoutUpper Enclosure Upper EnclosureMaximumSubstrateThickness (mm)MaximumSpeed (rpm)MaximumSpeed (rpm)MaximumSpeed (rpm)MaximumMaximum SpinSubstrateSpeed (rpm)Thickness (mm)Delta 80GYRSET 843000*7000*1000*123000*Delta 80GYRSET 554000*7000*1000*123000*Delta 80GYRSET 355000*7000*1000*123000** Speeds based on semi spec Si wafers or Substrates with equivalent dimensions & weight;Other wafers or substrates can be accomodated on request with potential limitations to spin speed;See your local SUSS representative.3 Single Side Chuck3 Single Side Chuck with AdapterOptionsDouble Side (LC)* And Single Side ChucksSolvent Dispense NozzleChoose either double or single side chucks in 8, 2 orsmaller sizes.
The substrates are vacuum-locked duringprocessing. The vacuum patterns, support pins andlocating pins are designed according to your components and adapted to the options chosen.Choose this programmable option for solvent cleaningor developing and for adhesion promoter dispense.
Itincludes all tubing, valve and flowmeter.Adapters For Small PiecesAvailable for single side chucks, these adapters allowyou to process pieces up to 2 on a larger size chuck.Releases a jet of nitrogen across your wafer / substratebefore processing and helps to remove any dust anddirt particles from the surface, thereby cleaning thecomponent.Dispense ArmsCotton Candy RemoverThe Delta 80 can be configured with a programmableelectronic dispense arm. It provides more flexibility, isfully programmable in speed, acceleration and positionand can be equipped with up to 6 media lines – maximum 4 resist lines and 2 solvent lines.
It is also possibleto fit the edge bead remover, nitrogen purge or bowlautoclean option.This programmable solvent nozzle dispenses solventonto the GYRSET® cover to remove stringers (cottoncandy) at the edge of the cover. It also cleans the process chamber before the process stops.Edge Bead RemoverBowl Auto CleanThis fully programmable option removes the resist buildup at the edge of the wafer. Therefore a needle typenozzle dispenses solvent at a defined radial position ofthe wafer.Programmable cleaning cycle cleans the chuck and theprocess bowl. The auto-cleaning frequency can be seteither by time or numbers of cycles.Nitrogen PurgeOptionsIt provides excellent results and reduces substrate contamination due to cotton candy effects.7LithographyOptionsResist Nozzle Auto CleanThis fully programmable option injects solvent onto therequired dispense nozzle dissolving any residue andcleaning the inside of the nozzle.spin speeds (see table on page 6).
Without upperenclosure the open bowl spin speed is limited tolower values for operator safety.Dispense SystemsLaptopThe Delta 80 can be equipped with a large variety ofdispense systems:The laptop option with a Windows® based user interface software allows for easy recipe programmingand storage for an unlimited number of recipes.쮿 Motorized and pneumatic syringe systems for experimental setups or specialty chemicals.This large variety allows an extremely high flexibility.Chuck LiftAllows easy loading and unloading of the wafer combined with the standard chuck indexing for repeatablewafer positioning.Open BowlThe Delta 80 GYRSET® Coater can also be operated asa standard open bowl coater. The optional upper enclosure allows for utilisation of the full range of open bowlStainless Steel CabinetThe stand alone cabinet integrates the Delta 80 SpinCoater with selected options, like our Delta 6 / 8 Hotplate Modules into a small footprint. The top platewith the front panels of the cabinet are made ofpolished stainless steel.Side and back panels are made of brushed stainlesssteel and are easily removed allowing easy accessto all components.The perforated top plate provides a laminar flowassuring proper ventilation through the process.
Foradded safety and reduced contamination the mediaand electronic controller are seperated. All connections for media and power are located on the backof the cabinet simplifying installation.Options쮿 Motorized & pneumatic dispense pumps and pressurized dispense systems for volume applications,8Technical DataWafer / Substrate SizeLithographyWafer sizeSubstrate sizeup to 8 ( 200 mm)up to 6 6 (150150 mm)873Delta 80 BM / Requirements481Drain410463VoltageCompressed airVacuumNitrogenExhaustDimensionsSpinner module (WDH)Controller (WDH)Panel interface (WDH)230 VAC / 50 Hz / 16 A5–6 bar / tube OD 8 mmmin.
– 0.7 bar / tube OD 6 mm4.5 bar / tube OD 6 mmOD 100 mm (1)463440875 mm*(18.217.334.4*)* with open GYRSET® cover and waste bottle483450140 mm (19.017.75.5)19656110 mm (4.37.72.2)1800135087570 + 38 EinstellbereichDelta 80 T+T2 / Requirements1200VoltageCompressed airVacuumNitrogenExhaustDimensionsFootprint (WDH)400 VAC / 50 Hz / 16 A5–6 bar / tube OD 8 mmmin. – 0.7 bar / tube OD 8 mm4.5 bar / tube OD 8 mmOD 100 mm (3)12006421800 mm(47.225.370.9)VoltageCompressed airVacuumNitrogenExhaustDimensionsFootprint (WDH)400 VAC / 50 Hz / 16 A5–6 bar / tube OD 8 mmmin.
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