Cee_Spin_Chucks_Brochure (1063360)
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Brewer Science Cee Equipment®®Spin Chuck DesignsThe Brewer Science® Cee® equipment product portfolio offers over 400spin chuck designs that can accomodate a wide range of substrate sizes,shapes, or materials.Spin chuck design sizes can range from 1/8-inch in diameter to 14-inches square, with 3/8-, 1/2-, and 3/4-inch spindle sizes. In-housemechanical engineers are available to modify existing concepts or create custom spin chuck designs, per specific customer requests.Recommended Sizes for Diameter of SubstratesStandard circular vacuum chucks are capable of processing substrates with a diameter of no more than twice the spin chuck surfacediameter.
For example, a 4 inch chuck would not be recommended for substrate sizes larger than 8 inches (200 mm) in diameter or8 inches square. As substrate size increases, the use of a centering device, and/or verification of optimal centering of the substrate,becomes increasingly critical for maintaining positive contact between the substrate and the vacuum surface. With standard-thickness(275-750 μm) substrates that are centered properly, a maximum spin speed range of 3,000 to 6,000 rpm and accelerations of 3,000 to6,000 rpm/s are recommended. As thickness increases, the maximum speed and acceleration must be decreased for safe operation.
Toprocess beyond these parameters, captive or recessed spin chucks are recommended.Cee® Standard Circular Vacuum and O-Ring Spin Chuck RangesPhysical Chuck DiameterRecommended Substrate Diameter Range1/8” (0.125”) External O-Ring3 mm-9.5 mm/0.125”-0.375”5/16” (0.312”) External O-Ring9 mm-18 mm/0.375”-0.750”0.75” Circular Vacuum19 mm-38 mm/0.75”-1.50”1.0” Circular Vacuum32 mm-50 mm/1.25”-2.0”1.5” Circular Vacuum45 mm-77 mm/2.0”-3.0”2.25” Circular Vacuum77 mm-127mm/3.0”-5.0”4.0” Circular Vacuum125 mm-200 mm/5.0”-8.0”6.188” Circular Vacuum200 mm-300 mm/8.0”-12.0”Where innovation takes flight!Page 1SMw w w.
b r e w e r s c i e n c e . c o mBrewer Science® Cee® Spin ChucksPage 2Design OptionsCircular Vacuum Spin ChucksThese basic spin chucks are recommended for standard-thickness (< 1 mm), circular and square substrates. Common constructionmaterials for these chucks are Delrin® (acetal), Kynar® (PVDF), Teflon® (PTFE), polyetheretherketone (PEEK), stainless steel, and anodizedaluminum.
The standard circular vacuum chucks are capable of processing substrates with a surface area that is not greater than twicethe actual spin chuck surface diameter. Example: a 4 inch chuck is not recommended for substrate sizes larger than 8 inches (200 mm) indiameter or 8 inches square. Thicknesses can range from 275 μm up to 6 mm. As thickness increases, both maximum speed and acceleration must be decreased for safe operation.
The use of a centering device, and/or verification of optimal centering of the substrate, becomesincreasingly critical to maintaining positive contact between the substrate and the vacuum surface. With properly centered standard-thickness substrates (275-750 μm), we recommend maximum speed ranges of 3,000 to 6,000 rpm and accelerations of 3,000 to 6,000 rpm/s.If customers prefer to process beyond these parameters, we recommend captive or recessed spin chucks.Metallic (Stainless Steel or Anodized Aluminum) Spin ChucksStainless steel and anodized aluminum are selected for their robustness and strength-to-weight ratio. The standard TMAH developerapplication will not detrimentally affect stainless steel; however, it will affect anodized aluminum chucks.w w w.
b r e w e r s c i e n c e . c o mBrewer Science® Cee® Spin ChucksPage 3Spin Chucks with Polymer (Delrin®, Teflon®, Kynar®, or PEEK) SurfacesThese chucks are constructed of solid polymer or polymer laminates over anodized aluminum or stainless steel bases, depending on thechuck size and the application. This chuck type has several advantages of base metallic designs. The most significant benefit is chemicalcompatibility with developer, etching and cleaning chemicals (aggressive bases/acids). The polymer thermally insulates the substrate andeliminates “chuck marks” caused from non-uniform thermal transfer.
The soft polymer is non-marring and protects double-sided or opticaltransparent surfaces from damaging abrasions.Screwless External O-Ring ChucksThis design is intended for processing small samples (< 4 inches round), fragments, and irregularly shaped pieces. The external O-ringdesign can apply maximum vacuum grip and secure samples having diameters more than twice the chuck diameter.
This design seals andprotects the backside of the wafer and prevents wet materials from migrating into the vacuum system. Standard vacuum chucks feature acenter-securing spin chuck screw with through-hole port for delivering vacuum flow. Instead, this design relies on an internal O-ring for placement on and sealing to the chuck spindle.Recessed Spin ChucksWhen working with square or rectangular substrates, customers often struggle to eliminate edge buildup (non-uniformity) associated withuneven film drying in the corner regions.
Each recessed spin chuck is custom-made to house the exact dimensions and thickness of thecustomer’s square or rectangular substrate. The recessed cavity provides an auto-centering function and provides both lateral and vacuumgrip. This design emulates a round wafer by removing the leading edge of the square and thereby dissipating the normal turbulencecreated in the spin bowl atmosphere.
This design virtually eliminates edge interference bands. Additional distinct advantages of this designinclude complete backside coverage and mitigation of potential rear side contamination. Brewer Science® Cee® equipment is uniquelycapable of combining recessed chuck technology, high accelerations, and multiple spin speeds to virtually eliminate edge effect issues.w w w. b r e w e r s c i e n c e . c o mBrewer Science® Cee® Spin ChucksPage 4Captive Spin ChucksThese chucks have four pins positioned 90 degrees from each other and are the same size as the substrate to be coated.
The pins are lowerthan the top of the substrate to allow the coated material to flow off of the substrate without disruption. This design provides an accurateauto-centering function and additional lateral support for the substrate. A different chuck will be needed for each specific substrate size, andchucks can be constructed with polymeric and/or metallic materials.Porous Ceramic Insert Spin Chucks for Thin-Wafer HandlingUtilized for thinned substrates (< 250 μm), these spin chucks are constructed of a porous ceramic insert inside a recessed chuck cavity. Theyhave the distinct advantage of completely supporting the backside of any given substrate dimension and equally distributing (diffusing)the vacuum source across the entire porous surface.
This design mitigates potential vacuum-caused deflection and damage to the fragilesubstrate or coated film layer.w w w. b r e w e r s c i e n c e . c o mPage 5Brewer Science® Cee® Spin ChucksFilm-Frame Porous Ceramic Insert Spin Chucks for Thin-Wafer HandlingMechanical clamps and a porous ceramic insert are combined for spin coating or cleaning thinned substrates (< 250 μm) that have beentaped to film frames. The ceramic insert ensures complete and uniform backside support while diffusing the vacuum source.
This componentutilizes both vacuum O-rings and mechanical clamps for securing the outer film frame to the chuck assembly. BrewerScience® Cee® spin coaters and cleaners feature an industry-leading horsepower/torque motor drive system, which is required for maximumacceleration of this design.Pedestal Non-Vacuum Spin ChucksThe pedestal design is used to secure the substrate above the chuck surface without vacuum grip. The substrate is held in place by mechanical securing tabs mounted 90 degrees from each other.
These chucks are utilized when vacuum retention is not feasible due to materialmigration, backside contamination, and/or non-planar surfaces. Each chuck is custom designed and size-specific.Perimeter Vacuum Spin ChucksBrewer Science has developed this concept for coating applications that prohibit a vacuum source being applied to the internal area of thesubstrate. Vacuum is directed only to the outside edge (2-5mm exclusion) of the substrate and each design is size specific.
This componentis compatible and designed to accommodate both primary and secondary flats and mitigate risks associated with imbalance.w w w. b r e w e r s c i e n c e . c o mBrewer Science® Cee® Spin ChucksPage 6Hard Drive/Compact Disc Drive Spin ChucksBrewer Science has developed specific HD/CD chucks that utilize two vacuum O-rings for creating a positive seal with the bottom side ofthe disc.
An internal pedestal is machined with precision tolerances to match both the specific inner diameter of the disc and the overall discthickness. This design emulates a standard round substrate, allowing the material to be dispensed onto the center of the pedestal(protrusion) and spread uniformly across the entire disc surface.Custom Multi-Substrate Spin ChucksCustom multi-substrate spin chucks provide the capability for processing multiple substrates (2 to 12 size dependent) simultaneously in orderto increase overall throughput.
The recessed design concept is commonly utilized and each chuck is custom-made to house the exactdimensions and thickness of the customer’s substrate. This design emulates a round wafer by removing the leading edge of the multiplewafers and dissipates the turbulence in the spin bowl chamber.©2012 Brewer Sciience, Inc. All statements, technical information and recommendations contained herein are based on tests we believe to be accurate, but the accuracy or completeness thereof is not guaranteed and the following is made in lieu of warranty expressed or implied.Neither the seller nor manufacturer shall be liable for any injury, loss or damage, direct or consequential, arising from the use or inability to use the product.
Before using, user shall determine the suitability of the product for his intended use, and user assumes all risk and liabilitywhatsoever in connection therewith. No statement or recommendation not contained herein shall have any force or effect unless in an agreement signed by officers of the seller and manufacturer.Cee® is a registered trademark of Brewer Science, Inc.Delrin® and Teflon® are registered trademarks of DuPont.Kynar® is a registered trademark of Arkema, Inc.F.6.6.7082.A Effective Date: 12/05/2012w w w. b r e w e r s c i e n c e . c o m.
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