Roland A. - PVD for microelectronics (779636), страница 6
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There arealso a large number of books dealing with the general topic of thin filmsfor semiconductor applications. Since the primary use of PVD in microelectronics is directed at interconnect and metallization technology, bookson this topic often contain chapters on the materials science of relevantPVD thin films (e.g., Ti, TiSi 2, TiN, AI-Cu-Si alloys, etc.) and on theirprocess integration. In addition to the handbooks mentioned earlier, thefollowing books on thin film technology also include much valuable information: Handbook of Multilevel Metallization for Integrated Circuits[1.15], Thin Film Deposition: Principles & Practice [1.16], Film Deposition by Plasma Techniques [1.17], and Principles of Plasma Dischargesand Materials Processing [ 1.18].Manual or computer searches of scientific data bases under key wordssuch as PVD, physical vapor deposition, sputtering, etc.
will provide useful sources; a good starting point is the Journal of Vacuum Science andTechnology, which has published many excellent papers and reviews onthe physics and technology of sputtering. Several other scientific journalsalso have a strong history of reporting process, hardware, and devicerelated developments in PVD science and technology, including (in alphabetical order) Applied Physics Letters, IEEE Transactions on Elec-tron Devices, Japanese Journal of Applied Physics, Japanese Journalof Applied Physics Letters, Journal of Applied Physics, Journal of theR.
POWELL AND S. M. ROSSNAGELElectrochemical Society, and Thin Solid Films. Given the trend towardelectronic publishing, it should soon be possible to obtain journals such asthese on CD-ROM to facilitate both searching and retrieving PVD-relatedinformation. In addition, it is now possible to use the Internet to get online information about microelectronic manufacturing in general and PVDin particular.
While a number of search engines can be used to locate specific information, the web home pages of trade publications such as Semiconductor International (http://www.semiconductor-intl.com) and SolidState Technology (http://www.solid-state.com) are a convenient entrypoint for general information on microelectronic manufacturing. Also,suppliers of PVD hardware have worldwide web sites permitting 24 houra-day, real time access to company information, press releases, interactivecatalogs, product brochures, data sheets and technical reports.
Finally,large scientific societies such as the American Institute of Physics(http://www.aip.org/aiphome.html) have established home pages thatallow visitors to browse through periodicals of member s o c i e t i e s - suchas the Journal of Vacuum Science & Technology published by the American Vacuum Society.Many conferences regularly solicit papers on PVD for microelectronicsand publish technical proceedings. For example, the yearly VLSIMultilevel Interconnection Conference (VMIC) has provided a forum forthe discussion of advanced PVD processing technology since 1986; itspublished proceedings document many important developments in thefield. Also of note are the yearly proceedings of the American VacuumSociety (AVS) National Symposium, the biyearly (spring and fall) Materials Research Society (MRS) Symposium, the biyearly (spring and fall)Electrochemical Society (ECS) Symposium, the International ElectronDevices Meeting (IEDM), the International Conference on MetallurgicalCoatings and Thin Films (ICMCTF), and the International InterconnectTechnology Conference (IITC) which began in 1998.Peer-reviewed papers in scientific journals and conferences are complemented by so-called trade publications such as SemiconductorInternational and Solid State Technology, both of which regularly includebrief overview articles by their editorial staff and outside authors onprocess and hardware trends in sputter deposition for semiconductor, magnetic disk, and flat panel display fabrication.
These articles are extremelyuseful and usually include topical comments from both PVD equipmentsuppliers and end users (see Fig. 1.11). Several trade publications also provide an annual buyers' guide, which includes a directory of vendors ofproducts and services related to PVD ~ e.g., Solid State Technology's"Resource Guide," Semiconductor International's "Product Data Source,"INTRODUCTIONiCitationTitle of R e v i e w ArticleThe Reas~ing Behind "Cost of Ownership"19J. Secres! and P. Burggraaf,Semiconductor tnt'l, pp. 56-80 (May 1993~)P. Singer,Semiconductor lnt'l, pp.
57-64 (Au~l 1994)Silicidles for High Density Memoryand Lo~ltc CircuitsJ. Wmnerl,Semiconductor Int'l, pp. 81-86 (Aug 1994)New Interconnect Materials:Chasing the Promise of Fester ChipsP. &nger,Semiconductor lnt'l, pp. 52-56 {Nov 1994tInterconnect Metalllzalion forFuture Device GenerationsB. Roberts, A. Harrus and R. L. Jackson,Solid State Technolo~ly, pp.
69-78..(Feb 1995)Electrostatic Chucks in Wafer ProcessingP. Singer,The Driving Forces in Cluster ToolDevelopmentP. Singer,Straightening Out Sputter DepositionP. Burggraaf,Semrconductor Int'/, pp. 69-74 (Au~ 1996)........Filling Contacts and Vies: A Progress ReportSemiconductor/nt'/, pp. 57-64 (April 1995)Semiconductor lnt'/, pp. 113-118 (July 19951P. Singer,Semiconductor Int'l, pp.
89-94 (Feb 1996)Low k Dielectrics: The Search ContinuesP. Singer,Semiconductor Int'l. pp. 88-96 (May 19961Design Challenges In Vacuum RoboticsE. Korczynsk=,Sohd State Technology, pp. 62-70 (Oct 1996)Depositing Diffusion BarriersJ. Baliga,Semiconductor lnt'l, pp. 76-82 (Mar 1997)FIG. 1. il Articles from trade publications provide a capsule summary of PVD equipment and processdevelopment.
Selected articles from Semiconductor International and Solid State Technology that address hardware and process issues of sputter deposition for microelectronics are used for illustration.and R&D Magazine's "Product Source." PVD system suppliers as well assuppliers of peripheral hardware and consumables (e.g., vacuum pumps,robotic arms, sputter targets) maintain technical reports and reprints of articles written by their staff.
These reports can usually be obtained simplyby contacting their customer support or marketing organizations.Without question, the premier semiconductor fabrication equipmenttrade show is SEMICON-West, which is held in the San Francisco area andincludes exhibits by all major suppliers of PVD hardware and often company-sponsored technical seminars highlighting a supplier's latest productor process introduction.
The global nature of both IC device fabricationand the semiconductor process equipment market has led to similar SEMICON shows in many other parts of the world (e.g., SEMICON-Southwest,SEMICON-Japan, SEMICON-Korea, and SEMICON-Taiwan). All ofthese shows generally include technical sessions relevant to PVD withwritten proceedings; however, these proceedings are not always easy toobtain after the fact.20R.
POWELL AND S. M. ROSSNAGELShort courses on PVD are regularly offered by a number of societies, such as the AVS and the MRS, and related process, hardware, and metrology workshops are sponsored by SEMATECH, the SemiconductorResearch Corporation (SRC), and the Semiconductor Equipment andMaterials Institute (SEMI).Finally, a valuable source of information that is often overlooked is published patents. A patent begins with a brief overview of the "state of theart," which sets the stage for a discussion of what is new and differentabout the patented invention.
Therefore, one can quickly get informed ona wide range of topics such as PVD cluster tool architecture, backside gasconduction cooling, magnetron sputter source design, electrostatic chucksfor PVD, etc. by obtaining copies of key patents and reading the introductory sections that provide a brief, critical review of the technology.References1.1. W. R. Grove, "On the electro-chemical polarity of gases," Phil. Trans. R.
Soc. 142:87-101(1852).1.2. E. Korczynski, "VMIC: Alternatives for interconnections," Solid State Tech., 40 (Sept. 1995).1.3. K.C. Saraswat and E Mohammadi, "Effect of scaling on interconnections on the time delay ofVLSI circuits," IEEE Trans. on Electron Devices ED-29(4): 645-650 (1982).!.4. D. M. Brown, M. Ghezzo, and J. M.
Pimbley, "Trends in advanced process technologySubmicrometer CMOS device design and process requirements," Proc. IEEE 74(12):1678-1702 (1986).1.5. M. T. Bohr, "Interconnect scaling - - T h e real iimiter to high performance ULSI," Solid State7~'ch. 105-111 (Sept. 1996).1.6. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association,San Jose, CA, 1994 and 1997; see also summary of the 1994 Roadmap in Solid State Tech.,42-53 (Feb. 1995)./.Z T. Kodas and M.
Hampden-Smith, The Chemistry of Metal CVD, chapter 1, VCH Publishers,New York, 1994.!.8. Physical Vapor Deposition, 2nd ed., R. J. Hill, Ed., Temescal, a division of the BOC Group,Berkeley, CA, 1986.1.9. David B. Fraser, "The Sputter and S-Gun Magnetrons," in Thin Fihn Processes, pp. !! 5-129,John L. Vossen and Werner Kern, Eds., Academic Press, New York, 1978.i. !0. Robert K. Waits, "Planar Magnetron Sputtering," in Thin Fihn Processes, pp. 131-173, John L.Vossen and Werner Kern, Eds., Academic Press, New York, 1978.1. I1. Stephen M. Rossnagel, "Glow Discharge Plasma and Sources for Etching and Deposition," inThin Fihn Processes II, pp.
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