Rohsenow W., Hartnett J., Young Cho. Handbook of Heat Transfer (776121)
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HANDBOOK OFHEAT TRANSFERWarren M. RohsenowEditorDepartment of Mechanical EngineeringMassachusetts Institute of TechnologyJames R HartnettEditorEnergy Resources CenterUniversity of Illinois at ChicagoYoung I. Cho EditorDepartment of Mechanical Engineering and MechanicsDrexel UniversityThird EditionMCGRAW-HILLNew York San Fran©isco Washington, D.C. Auckland Bogot6Caracas Lisbon London Madrid Mexi©oCity MilanMontreal New Delhi San Juan SingaporeSydney Tokyo TorontoLibrary of Congress Cataloging-in-Publication DataH a n d b o o k of heat transfer / editors, W.M.
Rohsenow, J.P. H a r t n e t t ,Y.I. Cho. m 3rd ed.p.cm.Includes bibliographical references and index.I S B N 0-07-053555-8 (alk. p a p e r )1. H e a t - - T r a n s m i s s i o n m H a n d b o o k s , manuals, etc. 2. Mass t r a n s f e r mH a n d b o o k s , manuals, etc. I. Rohsenow, W. M. ( W a r r e n M.) II. H a r t n e t t ,J. E (James E) III. Cho, Y. I. (Young I.)QC320.4.H36 1998621.402'2--dc2197-51381CIPMcGraw-HillA Division o[ The McGraw.Hill ~ i e sCopyright © 1998 by The McGraw-Hill Companies, Inc. All rights reserved. Printed inthe United States of America. Except as permitted under the United States CopyrightAct of 1976, no part of this publication may be reproduced or distributed in any form orby any means, or stored in a data base or retrieval system, without the prior written permission of the publisher.1 2 3 4 5 6 7 8 9 0DOC/DOC9 0 3 2 1 0 9 8ISBN 0-07-053555-8The sponsoring editor for this book was Robert Esposito, the editing supervisor wasStephanie S.
Landis, and the production supervisor was Pamela A. Pelton. It was set inTimes Roman by North Market Street Graphics.Printed and bound by R. R. Donnelley & Sons Company.McGraw-Hill books are available at special quantity discounts to use as premiums andsales promotions, or for use in corporate training programs. For more information,please write to the Director of Special Sales, McGraw-Hill, 11 West 19th Street, NewYork, NY 10011.
Or contact your local bookstore.Information contained in this work has been obtained by TheMcGraw-Hill Companies, Inc. ("McGraw-Hill") from sourcesbelieved to be reliable. However, neither McGraw-Hill nor itsauthors guarantee the accuracy or completeness of any information published herein, and neither McGraw-Hill nor its authorsshall be responsible for any errors, omissions, or damages arisingout of use of this information. This work is published with theunderstanding that McGraw-Hill and its authors are supplyinginformation but are not attempting to render engineering or otherprofessional services. If such services are required, the assistanceof an appropriate professional should be sought.This book is printed on acid-flee paper.CONTRIBUTORSBergles, Arthur E.
Department of Mechanical Engineering, Rensselaer Polytechnical Institute (CHAP.11, Techniques to Augment Heat Transfer), e-mail: abergles@aol.comBergman, Theodore L. Departmentof Mechanical Engineering, University of Connecticut (CHAP. 18,Heat Transfer in Materials Processing), e-mail: tberg@eng2.uconn.eduChauk, Shriniwas Departmentof Chemical Engineering, Ohio State University (CHAP.
13, Heat Transfer in Fluidized and Packed Beds)Chen, Ping-Hai Department of Mechanical Engineering, National Taiwan University, Taiwan, ROC(CHAP. 16, Measurement of Temperature and Heat Transfer), e-mail: phchen@ccms.ntu.edu.twChiang, Hwai Derg IndustrialTechnology Research Institute, Taiwan, ROC (CHAP.16, Measurement ofTemperature and Heat Transfer), e-mail: hdc@erl.itri.org.twCho, Young I. Departmentof Mechanical Engineering and Mechanics, Drexel University (CHAP.1, BasicConcepts of Heat Transfer; CHAP.10, Nonnewtonian Fluids), e-mail: ycho@coe.drexel.eduDong, Z.F.
Departmentof Mechanical Engineering, Florida International University (CHAP. 5, ForcedConvection, Internal Flows), e-mail: zdong@agilis.comEbadian, M.A. Hemispheric Center for Environmental Technology, Florida International University(CHAP. 5, Forced Convection, Internal Flows), e-mail: ebadian@eng.fiu.eduFan, L.S. Departmentof Chemical Engineering, Ohio State University (CHAP.13, Heat Transfer in Fluidized and Packed Beds), e-mail: fan@kcgll.eng.ohio-state.eduGoldstein, Richard J. Department of Mechanical Engineering, University of Minnesota (cHar,. 16,Measurement of Temperature and Heat Transfer), e-mail: goldstei@mailbox.mail.umn.eduHartnett, J a m e s P.
Energy Resources Center, University of Illinois, Chicago (CHAP. 1, Basic Conceptsof Heat Transfer; CHAP.10, Nonnewtonian Fluids), e-mail: hartnett@uic.eduHewitt, Geoffrey F. Departmentof Chemical Engineering and Chemical Technology, Imperial Collegeof Science, Technology and Medicine, London, UK (CHAP. 15, Boiling), e-mail: g.hewitt@ic.ac.ukHollands, K.
G.T. Department of Mechanical Engineering, University of Waterloo, Canada (CHAP. 4,Natural Convection), e-mail: kholland@solarl.uwaterloo.caHowell, John R. Departmentof Mechanical Engineering, University of Texas at Austin (CHAP.7, Radiation), e-mail: jhowell@mail.utexas.eduInouye, MamoruFlows)Ames Research Center--NASA (retired) (CHAP.6, Forced Convection, ExternalIrvine, Thomas F., Jr. Departmentof Mechanical Engineering, State University of New York (CHAP.2,Thermophysical Properties), e-mail: tirvine@ccmail.sunysb.eduKaviany, Massoud Department of Mechanics and Applied Mechanics Engineering, University ofMichigan (CHAP.9, Heat Transfer in Porous Media), e-mail: kaviany@umich.eduMajumdar, Arun Departmentof Mechanical Engineering, University of California, Berkeley (CHAP.8,Microscale Heat Transfer), e-mail: majumdar@newton.berkeley.edui a r t o , Paul J.
Departmentof Mechanical Engineering, Naval Postgraduate School (CHAP.14, Condensation), e-mail: pmarto@nps.navy.milXVIIxviiiCONTRIBUTORSMengO;, M. Pinar Department of Mechanical Engineering, University of Kentucky (CHAP. 7, Radiation), e-mail: menguc@pop.engr.uky.eduPeterson, G. P. Bud Departmentof Mechanical Engineering, Texas A&M University (CHAP. 12, HeatPipes), e-mail: gpp5386@teesmail.tamu.eduParikh, Pradip G.
Boeing Commercial Airplane Group (CHAP.6, Forced Convection, External Flows),e-mail: pradip.g.parikh@boeing.comRaithby, George D. Departmentof Mechanical Engineering, University of Waterloo, Canada (CHAP.4,Natural Convection), e-mail: graith@asc.on.caRubesin, Morris W. Ames Research Center--NASA (retired) (CHAP. 6, Forced Convection, ExternalFlows), e-mail: mrubesin@aol.comSekulic, Dusan P. Department of Mechanical Engineering, University of Kentucky (CHAP. 17, HeatExchangers), e-mail: sekulicd@engr.uky.eduShah, Ramesh K.
Delphi Harrison Thermal Systems, Lockport, NY (CHAP. 17, Heat Exchangers),e-mail: rkshah@ibm.netViskanta, Raymond Schoolof Mechanical Engineering, Purdue University (CHAP.18, Heat Transfer inMaterials Processing), e-mail: viskanta@ecn.purdue.eduYovanovich, M. Michael Departmentof Mechanical and Electrical Engineering, University of Waterloo, Canada (CHAP.3, Conduction), e-mail: mmyov@mhtl.uwaterloo.caPREFACEINTRODUCTIONSince the publication of the second edition of Handbook of Heat Transfer, there have beenmany new and exciting developments in the field, covering both fundamentals and applications. As the role of technology has grown, so too has the importance of heat transfer engineering.
For example, in the industrial sector heat transfer concerns are critical to the designof practically every process. The same is true of such vitally important areas as energy production, conversion, and the expanding field of environmental controls. In the generation ofelectrical power, whether by nuclear fission or combustion of fossil fuels, innumerable problems remain to be solved. Similarly, further miniaturization of advanced computers is limitedby the capability of removing the heat generated in the microprocessors. Heat transfer problems at the macro scale, as exemplified by global warming, also offer tremendous challenges.As technology advances, engineers are constantly confronted by the need to maximize orminimize heat transfer rates while at the same time maintaining system integrity.
The upperand lower boundariesmsystem size, pressure, and temperature--are constantly expanding,confronting the heat transfer engineer with new design challenges.In preparing this third edition, the goal of the editors was to provide, in a single volume,up-to-date information needed by practicing engineers to deal with heat transfer problemsencountered in their daily work. This new edition of the handbook contains informationessential for design engineers, consultants, research engineers, university professors, students,and technicians involved with heat transfer technology.COVERAGEThe third edition of Handbook of Heat Transfer provides expanded treatment of the fundamental topics covered in earlier editions.
More than half of the authors of these basic chapterson conduction, convection, radiation, condensation, and boiling are new, reflecting the factthat there are new leaders in the field. Those chapters in the second edition dealing withapplications related to the so-called energy crisis (solar energy, energy storage, cooling towers, etc.) have been replaced by new chapters treating heat transfer problems encountered inmaterials processing, porous media, and micro scale systems. Sections on the following topicswere retained and updated: thermophysical properties, heat transfer enhancement, heatexchangers, heat pipes, fluidized beds, nonnewtonian fluids, and measurement techniques.UNITSIt is recognized at this time that the English Engineering System of units cannot be completely replaced by the International System (SI).
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